Patents by Inventor Mika Kowa

Mika Kowa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip mounting substrate having an integral molded projection and conductive pattern
    Patent number: 5081520
    Abstract: The present invention provides an improved chip mounting method for mounting an IC chip on a substrate, comprising the steps of; integrally molding a projection on the substrate, the projection being located on a surface of the substrate on which the IC chip will be mounted; forming a conductive pattern on the projection and on a necessary portion of the substrate; forming a connecting layer on the conductive pattern formed on the projection; and fixing said IC chip on the substrate while electrically connecting an exposed electrode of the IC chip with the conductive pattern formed on the projection through the connecting layer.
    Type: Grant
    Filed: May 16, 1990
    Date of Patent: January 14, 1992
    Assignee: Minolta Camera Kabushiki Kaisha
    Inventors: Masayuki Yoshii, Yoshiyuki Mizumo, Shunji Oku, Mika Kowa