Abstract: A power electronic apparatus with cooling arrangement comprises a housing (1) that accommodates the power electronic components (5). At least two adjacent axial fans (4) are connected to the housing (1) for inducing an airflow from outside into the housing (1) in order to cool the power electronic components (5). Furthermore, at least one pair of said adjacent fans (4) is disposed at an angle ? with respect to each other in order to reduce noise caused by the fans. Such a cooling arrangement provides a power electronic apparatus with effective cooling in compact size and also having an acceptable level of noise.

Abstract: A power electronic device with cooling arrangement includes a housing that accommodates power electronic components. At least two adjacent axial fans are connected to the housing for inducing an airflow from outside into the housing in order to cool the power electronic components. Furthermore, the device can include a separating wall that extends outside the housing from between the at least two adjacent axial fans in order to reduce noise caused by the fans. Such a cooling arrangement can provide a power electronic device with effective cooling in compact size and also having an acceptable level of noise.

Abstract: A power electronic device with cooling arrangement includes a housing that accommodates power electronic components. At least two adjacent axial fans are connected to the housing for inducing an airflow from outside into the housing in order to cool the power electronic components. Furthermore, the device can include a separating wall that extends outside the housing from between the at least two adjacent axial fans in order to reduce noise caused by the fans. Such a cooling arrangement can provide a power electronic device with effective cooling in compact size and also having an acceptable level of noise.

Abstract: A power electronic apparatus with cooling arrangement comprises a housing (1) that accommodates the power electronic components (5). At least two adjacent axial fans (4) are connected to the housing (1) for inducing an airflow from outside into the housing (1) in order to cool the power electronic components (5). Furthermore, at least one pair of said adjacent fans (4) is disposed at an angle ? with respect to each other in order to reduce noise caused by the fans. Such a cooling arrangement provides a power electronic apparatus with effective cooling in compact size and also having an acceptable level of noise.

Abstract: The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. The invention also relates to a cooling method.

Abstract: The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average.

Abstract: The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. The invention also relates to a cooling method.