Abstract: An exemplary method of heat transfer in power electronics applications is disclosed, wherein a metal foil including at least about 50% of tin, based on a total amount of metals contained in the metal foil, is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. The metal foil is disposed on a heat sink. A base plate of a heat generating component or module is disposed on the heat sink covered by the metal foil to provide a power electronics device. A clamping force is applied to the power electronics assembly to provide a cooled power electronics assembly.

Abstract: A frequency converter unit includes a unit body, input bus bar means and output bus bar means. The input bus bar means have a plurality of input side bus bars spaced apart in a first direction, and the output bus bar means have a plurality of output side bus bars spaced apart in the first direction, which is perpendicular to an installation direction of the frequency converter unit. Each of the plurality of input side bus bars and the plurality of output side bus bars includes an aperture configured to connect the bus bar to a counterpart contact in a frame with a bolt-nut connection.

Abstract: An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement is disclosed for cooling the choke unit, the power step unit, and the capacitor unit. The choke unit, the power step unit, and the capacitor unit can be distributed into at least two separate and separately coolable entities, and the cooling arrangement can include parallel cooling apparatuses for cooling the at least two separate and separately coolable entities.

Abstract: An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.

Abstract: An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement is disclosed for cooling the choke unit, the power step unit, and the capacitor unit. The choke unit, the power step unit, and the capacitor unit can be distributed into at least two separate and separately coolable entities, and the cooling arrangement can include parallel cooling apparatuses for cooling the at least two separate and separately coolable entities.

Abstract: An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.

Abstract: The invention relates to an environmental fuse, an actuator and to an associated method for protecting the actuator from failure in a specific operating environment. The environmental fuse then comprises a sensor member for detecting any change in the environment deviating from the tolerance allowed by a specific standard, and a functional member comprising functional means for limiting or interrupting the input to said actuator and/or for giving an alarm. The actuator may also comprise an environmental fuse.

Abstract: The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. The invention also relates to a cooling method.

Abstract: The invention relates to an environmental fuse, an actuator and to an associated method for protecting the actuator from failure in a specific operating environment. The environmental fuse then comprises a sensor member for detecting any change in the environment deviating from the tolerance allowed by a specific standard, and a functional member comprising functional means for limiting or interrupting the input to said actuator and/or for giving an alarm. The actuator may also comprise an environmental fuse.

Abstract: The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average.

Abstract: The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. The invention also relates to a cooling method.