Abstract: Fiber optic assemblies are used to link transceivers carrying a signal from the transmitter portion of one transceiver to the receiver portion of another transceiver. The fiber optic assemblies have fiber optic connectors with a gender of either male or female. When the fiber optic connectors have fiber optic connectors with the same gender, the plurality of optical fibers are inverted and when the fiber optic assemblies have fiber optic connectors with an opposite gender, the plurality of optical fibers are not inverted. The inversion may also occur when the fiber optic connectors have the opposite gender in an alternative embodiment.

Abstract: A loopback housing has an upper body portion and a lower body portion that are removably connected to one another. One of the body portions has a fiber opening to protect the optical fibers that are looped around for the fiber optic connector. The loopback housing also functions to remove and insert the fiber optic connector into an adapter, particularly in a high density application.

Abstract: A loopback housing has an upper body portion and a lower body portion that are removably connected to one another. One of the body portions has a fiber opening to protect the optical fibers that are looped around for the fiber optic connector. The loopback housing also functions to remove and insert the fiber optic connector into an adapter, particularly in a high density application.

Abstract: The present invention is directed to an apparatus and process for locally heating and/or cooling of semiconductor wafers in thermal processing chambers. In particular, the apparatus of the present invention includes a device for heating or cooling localized regions of a wafer to control the temperature of such regions during one or more stages of a heat cycle. In one embodiment, gas nozzles eject gas towards the bottom of the wafer to provide localized temperature control. In another embodiment, a transparent gas pipe containing a variety of gas outlets distributes gas onto the top surface of the wafer to provide localized temperature control.