Patents by Inventor Mike Killian

Mike Killian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7149134
    Abstract: A memory device (10) includes an array (12) of memory cells arranged in rows and columns. Preferably, each memory cell includes a pass transistor coupled to a storage capacitor. A row decoder (18) is coupled to rows of memory cells while a column decoder (14) is coupled to columns of the memory cells. The column decoder (14) includes an enable input. A variable delay (32) has an output coupled to the enable input of the column decoder (14). The variable delay (32) receives an indication (R/W?) of whether a current cycle is a read cycle or a write cycle. In the preferred embodiment, a signal provided at the output of the variable delay (32) is delayed if the current cycle is a read cycle compared to if the current cycle is a write cycle.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: December 12, 2006
    Assignee: Infineon Technologies AG
    Inventors: Harald Streif, Stefan Wuensche, Mike Killian
  • Patent number: 7060529
    Abstract: A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: June 13, 2006
    Assignee: Infineon Technologies AG
    Inventors: Manfred Reithinger, Mike Killian, Gerd Frankowsky, Oliver Kiehl, Gerhard Mueller, Ernst Stahl, Hartmud Terletzki, Thomas Vogelsang
  • Patent number: 7035150
    Abstract: A memory device (10) includes an array (12) of memory cells arranged in rows and columns. Preferably, each memory cell includes a pass transistor coupled to a storage capacitor. A row decoder is coupled to rows of memory cells while a column decoder (14) is coupled to columns of the memory cells. The column decoder (14) includes an enable input. A variable delay (32) has an output coupled to the enable input of the column decoder (14). The variable delay (32) receives an indication (R/W?) of whether a current cycle is a read cycle or a write cycle. In the preferred embodiment, a signal provided at the output of the variable delay (32) is delayed if the current cycle is a read cycle compared to if the current cycle is a write cycle.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: April 25, 2006
    Assignee: Infineon Technologies AG
    Inventors: Harald Streif, Stefan Wuensche, Mike Killian
  • Publication number: 20060050574
    Abstract: A memory device (10) includes an array (12) of memory cells arranged in rows and columns. Preferably, each memory cell includes a pass transistor coupled to a storage capacitor. A row decoder (18) is coupled to rows of memory cells while a column decoder (14) is coupled to columns of the memory cells. The column decoder (14) includes an enable input. A variable delay (32) has an output coupled to the enable input of the column decoder (14). The variable delay (32) receives an indication (R/W?) of whether a current cycle is a read cycle or a write cycle. In the preferred embodiment, a signal provided at the output of the variable delay (32) is delayed if the current cycle is a read cycle compared to if the current cycle is a write cycle.
    Type: Application
    Filed: October 26, 2005
    Publication date: March 9, 2006
    Inventors: Harald Streif, Stefan Wuensche, Mike Killian
  • Patent number: 6956409
    Abstract: System and method for detecting a reference signal. A preferred embodiment comprises a latch (such as the latch 320) and a filter (such as the filter 325). The latch tracks a reference signal at its input and reflects the reference signal at its output. The filter can be coupled to the output of the latch and may inject a delay to help eliminate the effects of glitches and noise. When the reference signal reaches a specified value, a control signal from the filter causes the latch to store the reference signal. A delay imparted by the filter ensures that the latch does not store the reference signal until a finite amount of time after the reference signal reaches the specified value.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: October 18, 2005
    Assignee: Infineon Technologies AG
    Inventors: Harald Streif, Oliver Kiehl, Mike Killian
  • Publication number: 20050046451
    Abstract: System and method for detecting a reference signal. A preferred embodiment comprises a latch (such as the latch 320) and a filter (such as the filter 325). The latch tracks a reference signal at its input and reflects the reference signal at its output. The filter can be coupled to the output of the latch and may inject a delay to help eliminate the effects of glitches and noise. When the reference signal reaches a specified value, a control signal from the filter causes the latch to store the reference signal. A delay imparted by the filter ensures that the latch does not store the reference signal until a finite amount of time after the reference signal reaches the specified value.
    Type: Application
    Filed: August 28, 2003
    Publication date: March 3, 2005
    Inventors: Harald Streif, Oliver Kiehl, Mike Killian
  • Publication number: 20050001298
    Abstract: A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer.
    Type: Application
    Filed: May 7, 2004
    Publication date: January 6, 2005
    Inventors: Manfred Reithinger, Mike Killian, Gerd Frankowsky, Oliver Kiehl, Gerhard Mueller, Ernst Stahl, Hartmud Terletzki, Thomas Vogelsang
  • Patent number: 6815803
    Abstract: A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: November 9, 2004
    Assignee: Infineon Technologies AG
    Inventors: Manfred Reithinger, Mike Killian, Gerd Frankowsky, Oliver Kiehl, Gerhard Mueller, Ernst Stahl, Hartmud Terletzki, Thomas Vogelsang
  • Publication number: 20040088475
    Abstract: A memory device (10) includes an array (12) of memory cells arranged in rows and columns. Preferably, each memory cell includes a pass transistor coupled to a storage capacitor. A row decoder is coupled to rows of memory cells while a column decoder (14) is coupled to columns of the memory cells. The column decoder (14) includes an enable input. A variable delay (32) has an output coupled to the enable input of the column decoder (14). The variable delay (32) receives an indication (R/W′) of whether a current cycle is a read cycle or a write cycle. In the preferred embodiment, a signal provided at the output of the variable delay (32) is delayed if the current cycle is a read cycle compared to if the current cycle is a write cycle.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Applicant: Infineon Technologies North America Corp.
    Inventors: Harald Streif, Stefan Wuensche, Mike Killian
  • Patent number: 6730989
    Abstract: A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted to the printed circuit board. The semiconductor package includes a fractional portion of a semiconductor wafer having a plurality of integrated circuit chips thereon, such chips being separated by regions in the fractional portion of the wafer. The fractional portion of the wafer has a plurality of electrical contacts electrically connected to the chips. The package also includes a dielectric member having an electrical conductor thereon. The electrical conductor are electrically connected to the plurality of electrical contacts of the plurality of chips to electrically interconnect such plurality of chips with portions of the electrical conductor spanning the regions in the fractional portion of the wafer.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: May 4, 2004
    Assignee: Infineon Technologies AG
    Inventors: Manfred Reithinger, Mike Killian, Gerd Frankowsky, Oliver Kiehl, Gerhard Mueller, Ernst Stahl, Hartmud Terletzki, Thomas Vogelsang
  • Patent number: 5995436
    Abstract: A circuit embodying the invention includes a gating circuit responsive to a first control signal and to a second externally supplied control signal having an active state and an inactive state. The first control signal is produced by a power supply circuit which is responsive to the application of an externally supplied operating voltage for producing an "internal" operating voltage and which produces the first control signal having an active state when the internal operating voltage reaches a predetermined value. The gating circuit has an output for producing a third control signal which is enabling only if the second control signal goes from its inactive state to its active state when the first control signal is already in, and remains in, its active state. The gating circuit prevents a chip from operating in an unintended mode at power-up.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: November 30, 1999
    Assignees: Siemens Aktiengesellschaft, Kabushiki Kaisha Toshiba
    Inventors: Martin Brox, Franz Freimuth, Mike Killian, Naokazu Miyawaki, Thilo Schaffroth
  • Patent number: 5881013
    Abstract: A circuit embodying the invention includes a gating circuit responsive to a first control signal and to a second externally supplied control signal having an active state and an inactive state. The first control signal is produced by a power supply circuit which is responsive to the application of an externally supplied operating voltage for producing an "internal" operating voltage and which produces the first control signal having an active state when the internal operating voltage reaches a predetermined value. The gating circuit has an output for producing a third control signal which is enabling only if the second control signal goes from its inactive state to its active state when the first control signal is already in, and remains in, its active state. The gating circuit prevents a chip from operating in an unintended mode at power-up.
    Type: Grant
    Filed: June 27, 1997
    Date of Patent: March 9, 1999
    Assignees: Siemens Aktiengesellschaft, Kabushiki Kaisha Toshiba
    Inventors: Martin Brox, Franz Freimuth, Mike Killian, Naokazu Miyawaki, Thilo Schaffroth
  • Patent number: 5333093
    Abstract: In order to restrict the voltage across the gate oxide of an input pass-through transistor which operates as an input signal source to a MOS inverter, a MOS transistor wired as a MOS diode is connected between the source and gate electrode of the pass-through transistor. The diode connected transistor allows the use of a thin oxide device for the pass-through transistor which enables a high transconductance device to be employed while restricting the voltage across the gate oxide of the pass-through transistor to an acceptable value.
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: July 26, 1994
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang H. Krautschneider, Mike A. Killian