Abstract: A component carrier which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a first electronic component and a second electronic component arranged in the stack, a first block and a second block arranged in the stack below the first electronic component and the second electronic component, and a third block and a fourth block arranged in the stack above the first electronic component and the second electronic component, wherein said blocks are thermally conductive.

Abstract: A component carrier includes a stack having at least one horizontal electrically conductive layer structure, at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and at least one vertical via being laterally offset from the semiconductor component. The at least one horizontal electrically conductive layer structure electrically connects the vertical via to a bottom main surface of the semiconductor component. The component carrier is configured for a current flow from the vertical via to the horizontal electrically conductive layer structure, from the horizontal electrically conductive layer structure to the bottom main surface of the semiconductor component, from the bottom main surface of the semiconductor component to an upper main surface of the semiconductor component, and from the upper surface of the semiconductor component to the outside of the component carrier.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: A component carrier with a stack that has at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and a highly-conductive block embedded in the stack and being thermally and/or electrically coupled with the semiconductor component is illustrated and described.

Abstract: A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.

Abstract: A component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; a heat removing and electrically conductive base structure; a component which is connected to the base structure so as to at least partially protrude from the base structure and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure on or above a top main surface of the component. A method of manufacturing such a component carrier is disclosed.

Abstract: A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

Abstract: A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.

Abstract: A component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; a heat removing and electrically conductive base structure; a component which is connected to the base structure so as to at least partially protrude from the base structure and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure on or above a top main surface of the component. A method of manufacturing such a component carrier is disclosed.

Abstract: A component carrier with a stack that has at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and a highly-conductive block embedded in the stack and being thermally and/or electrically coupled with the semiconductor component is illustrated and described.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.

Abstract: A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.

Abstract: The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.

Abstract: A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.

Abstract: A circuit board includes a plurality of circuit board areas, wherein the individual circuit board areas include at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract: A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

Abstract: A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.

Abstract: A printed circuit board structure that includes at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layers are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.