Patents by Inventor Mike Preston McKown

Mike Preston McKown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding process and system
    Patent number: 11548239
    Abstract: A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: January 10, 2023
    Assignee: Textron Innovations, Inc.
    Inventors: Phillip Anthony Kendrick, Lawrence Arthur Gintert, Herbert Lee Skidmore, Mike Preston McKown
  • BONDING PROCESS AND SYSTEM
    Publication number: 20210001570
    Abstract: A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 7, 2021
    Inventors: Phillip Anthony Kendrick, Lawrence Arthur Gintert, Herbert Lee Skidmore, Mike Preston McKown
  • Bonding process and system
    Patent number: 10800112
    Abstract: A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: October 13, 2020
    Assignee: Textron Innovations, Inc.
    Inventors: Phillip Anthony Kendrick, Lawrence Arthur Gintert, Herbert Lee Skidmore, Mike Preston McKown
  • BONDING PROCESS AND SYSTEM
    Publication number: 20180072003
    Abstract: A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 15, 2018
    Inventors: Phillip Anthony Kendrick, Lawrence Arthur Gintert, Herbert Lee Skidmore, Mike Preston McKown