Patents by Inventor Mike Reiter

Mike Reiter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux precoated solder preform for thermal interface material
    Publication number: 20080239660
    Abstract: In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises a pre-coated flux material.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 2, 2008
    Inventors: Lateef Mustapha, Carl Deppisch, Anna Prakash, Sai Jayaraman, Mike Reiter
  • PACKAGE AND METHOD FOR ATTACHING AN INTEGRATED HEAT SPREADER
    Publication number: 20060267182
    Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
    Type: Application
    Filed: August 2, 2006
    Publication date: November 30, 2006
    Inventors: Christopher Rumer, Sabina Houle, Oswald Skeete, Mike Reiter, Jeff Wienrich