Patents by Inventor Mike Schlicker

Mike Schlicker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Detection of surface defects by optical inline metrology during Cu-CMP process
    Patent number: 9018023
    Abstract: An efficient method of detecting defects in metal patterns on the surface of wafers. Embodiments include forming a metal pattern on each of a plurality of wafers, polishing each wafer, and analyzing the surface of the metal pattern on each polished wafer for the presence of defects in the metal pattern by analyzing an optical across-wafer endpoint signal, generated at the endpoint of polishing. Embodiments include determining the location of defects in the metal pattern by determining the position of non-uniformities in the optical-across-wafer endpoint signal.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: April 28, 2015
    Assignee: GLOBALFOUNDRIES Inc.
    Inventor: Mike Schlicker
  • DETECTION OF SURFACE DEFECTS BY OPTICAL INLINE METROLOGY DURING Cu-CMP PROCESS
    Publication number: 20130045546
    Abstract: An efficient method of detecting defects in metal patterns on the surface of wafers. Embodiments include forming a metal pattern on each of a plurality of wafers, polishing each wafer, and analyzing the surface of the metal pattern on each polished wafer for the presence of defects in the metal pattern by analyzing an optical across-wafer endpoint signal, generated at the endpoint of polishing. Embodiments include determining the location of defects in the metal pattern by determining the position of non-uniformities in the optical-across-wafer endpoint signal.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 21, 2013
    Applicant: GLOBALFOUNDRIES INC.
    Inventor: Mike Schlicker
  • System and method for optical endpoint detection during CMP by using an across-substrate signal
    Patent number: 8152595
    Abstract: In a polishing process, the characteristics of the removal process may be monitored at different lateral positions to identify the clearance of the various device regions with a high degree of reliability. Consequently, upon forming sophisticated metallization structures, undue over-polishing may be avoided while at the same time providing reduced leakage currents due to enhanced material removal.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: April 10, 2012
    Assignee: Advanced Micro Devices Inc.
    Inventors: Mike Schlicker, Gerd Marxsen
  • SYSTEM AND METHOD FOR OPTICAL ENDPOINT DETECTION DURING CMP BY USING AN ACROSS-SUBSTRATE SIGNAL
    Publication number: 20090275264
    Abstract: In a polishing process, the characteristics of the removal process may be monitored at different lateral positions to identify the clearance of the various device regions with a high degree of reliability. Consequently, upon forming sophisticated metallization structures, undue over-polishing may be avoided while at the same time providing reduced leakage currents due to enhanced material removal.
    Type: Application
    Filed: February 5, 2009
    Publication date: November 5, 2009
    Inventors: Mike Schlicker, Gerd Marxsen
  • CMP SYSTEM HAVING AN EDDY CURRENT SENSOR OF REDUCED HEIGHT
    Publication number: 20080242195
    Abstract: By providing an eddy current sensor element in a polishing tool at a reduced height level in combination with a corresponding optical endpoint detection system, standard polishing pads may be used, thereby enhancing the lifetime of the polishing pad and increasing tool utilization.
    Type: Application
    Filed: November 15, 2007
    Publication date: October 2, 2008
    Inventors: Jens Heinrich, Axel Kiesel, Uwe Stoeckgen, Mike Schlicker