Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 ?s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 ?s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape. The laser beam operates at a frequency of more than 67 Hz, and the spot of the laser beam is sequentially moved to different drilling positions for each pulse. After all of many drilling positions in the range of a scan vision are irradiated with the laser beam pulse by pulse, or after the elapse of a time of 15 ms or more from irradiation of the first drilling position, the laser spot is returned to the first drilling position. The spot is sequentially moved once again, and the movement is repeated several times.

Abstract: A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F? lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F? lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F? lens, and an object is set to be not more than 0.08.

Abstract: A laser beam machine according to the invention comprises a scanning lens for gathering laser light deflected by a deflection mirror on a workpiece for applying the laser light to a plurality of parts in a deflection area using the above-mentioned deflection mirror and the above-mentioned scanning lens and machining the workpiece. The laser beam machine comprises energy measurement means for measuring energy of the laser light applied to a plurality of different positions in the above-mentioned deflection area, so that the energy of the laser light applied to a plurality of different positions in the deflection area can be measured, occurrence of partial energy lowering depending on the laser light application position, caused by dirt of the scanning lens can be known, and appropriate maintenance is executed based on the information, whereby it is made possible to perform stable machining over a long term without causing a machining failure to occur.

Abstract: The present invention relates to a laser beam machine having a laser oscillator, for generating a laser beam; a light path system, including galvano mirrors and an f&thgr; lens that form a light path along which the laser beam emitted by the laser oscillator is guided to an object; and a diffractive optical element, located along the light path leading from the laser oscillator to the galvano mirrors.

Abstract: As a scanning device for positioning the irradiation position of the laser beam emitted from a laser oscillator at a position of arbitrary coordinates in the commanded mutually orthogonal X-axis direction and Y-axis direction, two galvanomirrors having mutually orthogonal rotary axes and a scan lens are provided, and the light generated from a printed circuit board irradiated with laser beam is detected by a detector, and approval or rejection of inspection result at each position of coordinates is judged on the basis of the output signal of the detector.

Abstract: A laser beam machine according to the invention comprises a scanning lens for gathering laser light deflected by a deflection mirror on a workpiece for applying the laser light to a plurality of parts in a deflection area using the above-mentioned deflection mirror and the above-mentioned scanning lens and machining the workpiece. The laser beam machine comprises energy measurement means for measuring energy of the laser light applied to a plurality of different positions in the above-mentioned deflection area, so that the energy of the laser light applied to a plurality of different positions in the deflection area can be measured, occurrence of partial energy lowering depending on the laser light application position, caused by dirt of the scanning lens can be known, and appropriate maintenance is executed based on the information, whereby it is made possible to perform stable machining over a long term without causing a machining failure to occur.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F&thgr; lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F&thgr; lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F&thgr; lens, and an object is set to be not more than 0.08.

Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: In a laser machining apparatus comprising a deflector for changing a direction of a laser beam outputted from a laser oscillator, and a converging lens for refracting the laser beam introduced from the deflector and focusing the laser beam onto a work to be machined, a lens position adjusting unit is provided for changing a relative position between a plurality of lenses constituting the converging lens and the lens position adjusting unit change the relative positions of the lenses so as to cancel a change in refractance of the lenses due to a change in the temperature.

Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Abstract: A laser machining apparatus comprises a laser oscillator for emitting a laser beam, a deflecting mirror for reflecting the laser beam emitted from the laser oscillator, a galvanometer scanner for swinging the deflecting mirror, and a mounting/holding mechanism for a galvanometer scanner capable of adjusting a mounting angular position of the galvanometer scanner around a shaft of the deflecting mirror.

Abstract: A laser beam machining apparatus including an image-transfer optical system having a mask inserted in an optical path between a laser oscillator and a workpiece, and a lens for reducing and forming an image of the mask on a processing surface; a focusing optical system; a drive unit for selecting one of the image-transfer optical system and the focusing optical system; and a numerical controller for controlling the image-transfer optical system, the focusing optical system, and the drive unit, wherein one of the image-transfer optical system and the focusing optical system is selected in correspondence with the diameter and depth of a hole to be processed.

Abstract: A laser machining system having a mirror for transmitting or reflecting laser light providing a sufficient light amount and light generated at a laser radiation point without degrading the laser light quality. A phase difference control mirror, which has a dielectric multilayer film as an optical film which allows light of a wavelength other than laser light to pass therethrough and which reflects the laser light almost 100% while the phase difference between S and P polarization components of the laser light before the laser light is reflected is substantially maintained, is provided in place of an optical path mirror located in an optical transmission line, whereby light of a wavelength other than that of the laser light can be extracted from the light generated at a laser radiation point on a workpiece during laser machining, and the extracted light is detected by an optical sensor.

Abstract: A method and apparatus for detecting the machining status of a laser beam machining device, having a multi-mirror resonator for generating a machining beam, which utilizes the secondary light generated by the machining operation and returned from the workpiece surface into the resonator for control of the machining operation. The oscillator and accompanying components, such as beam dividing mirrors and splitters, are operative to separate the secondary light from the laser beam within the resonator and direct the two beams separately to detectors located outside of the resonator. Alternatively, the secondary light and laser beam may be directed to the outside together where they are separated by an integrating sphere for detection.