Patents by Inventor Mikio Aizawa

Mikio Aizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing metal/polyimide composite article
    Patent number: 5120573
    Abstract: The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.
    Type: Grant
    Filed: September 27, 1989
    Date of Patent: June 9, 1992
    Assignees: Hitachi, Ltd., Nitto Denko Corporation
    Inventors: Kunio Miyazaki, Osamu Miura, Ryuji Watanabe, Yukio Ookoshi, Toshio Miyamoto, Mikio Aizawa, Kazumasa Igarashi, Amane Mochizuki
  • Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
    Patent number: 5072289
    Abstract: A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.
    Type: Grant
    Filed: November 8, 1989
    Date of Patent: December 10, 1991
    Assignee: Nitto Denko Corporation
    Inventors: Masakazu Sugimoto, Kazuo Ouchi, Mikio Aizawa, Atsushi Hino, Kazuto Shinozaki, Tetsuya Terada, Takanori Miyoshi, Munekazu Tanaka, Shoji Morita, Amane Mochizuki, Yoshinari Takayama