Patents by Inventor Mikio Sugawara

Mikio Sugawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of the semiconductor device
    Patent number: 6912172
    Abstract: Disclosed are a semiconductor chip which is uniquely value-added, a semiconductor integrated circuit device which improves the productivity and yield of products and facilitates the production management, and a method of manufacturing of semiconductor integrated circuit devices which enables the improvement of productivity and yield of products and the rational demand-responsive production management.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: June 28, 2005
    Assignees: Hitachi, Ltd., Akita Electronics Co., Ltd.
    Inventors: Kazuki Honma, Yoshiki Kawajiri, Masashi Wada, Mikio Sugawara, Hirofumi Sonoyama
  • Semiconductor device and method of the semiconductor device
    Publication number: 20040113176
    Abstract: Disclosed are a semiconductor chip which is uniquely value-added, a semiconductor integrated circuit device which improves the productivity and yield of products and facilitates the production management, and a method of manufacturing of semiconductor integrated circuit devices which enables the improvement of productivity and yield of products and the rational demand-responsive production management.
    Type: Application
    Filed: November 24, 2003
    Publication date: June 17, 2004
    Applicants: Hitachi, Ltd., Akita Electronics Co., Ltd.
    Inventors: Kazuki Honma, Yoshiki Kawajiri, Masashi Wada, Mikio Sugawara, Hirofumi Sonoyama
  • Semiconductor device in which a chip is supplied either a first voltage or a second voltage
    Patent number: 6667928
    Abstract: Disclosed are a semiconductor chip which is uniquely value-added, a semiconductor integrated circuit device which improves the productivity and yield of products and facilitates the production management, and a method of manufacturing of semiconductor integrated circuit devices which enables the improvement of productivity and yield of products and the rational demand-responsive production management.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: December 23, 2003
    Assignees: Hitachi, Ltd., Akita Electronics Co., Ltd.
    Inventors: Kazuki Honma, Yoshiki Kawajiri, Masashi Wada, Mikio Sugawara, Hirofumi Sonoyama
  • Semiconductor device and method of the semiconductor device
    Publication number: 20020191469
    Abstract: Disclosed are a semiconductor chip which is uniquely value-added, a semiconductor integrated circuit device which improves the productivity and yield of products and facilitates the production management, and a method of manufacturing of semiconductor integrated circuit devices which enables the improvement of productivity and yield of products and the rational demand-responsive production management.
    Type: Application
    Filed: April 26, 2002
    Publication date: December 19, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Kazuki Honma, Yoshiki Kawajiri, Masashi Wada, Mikio Sugawara, Hirofumi Sonoyama