Patents by Inventor Mikio Takigawa
Mikio Takigawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862443Abstract: A sputtering target comprising a target material, wherein a sputtering face of the target material has a ramp provided to reduce a thickness of the target material at a position where erosion concentrates most intensively during sputtering.Type: GrantFiled: November 2, 2020Date of Patent: January 2, 2024Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Toshiaki Kuroda, Mikio Takigawa
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Patent number: 11532468Abstract: Objects of the present invention consist in achievement of both of elongation of life of a sputtering target as well as uniformity of a thickness of a resulting thin coating layer formed on a substrate during the period. The present invention provides a sputtering target comprising a target material, which is characterized in that the target material has a sputtering surface having a first area placed at the center, which is circular and flat; and a second area placed outside of the first area and concentrically with the first area, which has a ring shape, wherein the first area is positioned at a location lower than that of the second area by 15% of thickness of the second area at most, and the first area has a diameter which is ranging from 60% to 80% of a circumferential diameter of the sputtering surface.Type: GrantFiled: January 20, 2015Date of Patent: December 20, 2022Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Mikio Takigawa, Toshiaki Kuroda
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Patent number: 11244814Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.Type: GrantFiled: September 21, 2020Date of Patent: February 8, 2022Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventor: Mikio Takigawa
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Publication number: 20210057196Abstract: A sputtering target comprising a target material, wherein a sputtering face of the target material has a ramp provided to reduce a thickness of the target material at a position where erosion concentrates most intensively during sputtering.Type: ApplicationFiled: November 2, 2020Publication date: February 25, 2021Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Toshiaki KURODA, Mikio TAKIGAWA
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Publication number: 20210005437Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventor: Mikio TAKIGAWA
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Patent number: 10886111Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.Type: GrantFiled: July 10, 2017Date of Patent: January 5, 2021Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventor: Mikio Takigawa
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Patent number: 10861684Abstract: A sputtering target comprising a target material, wherein a sputtering face of the target material has a ramp provided to reduce a thickness of the target material at a position where erosion concentrates most intensively during sputtering.Type: GrantFiled: March 26, 2018Date of Patent: December 8, 2020Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Toshiaki Kuroda, Mikio Takigawa
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Patent number: 10737352Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material, the process comprising: a step of heating the top face of the target material by a hot plate while pressing from above thereby diffusion-bonding the target material to the backing plate material in such a manner that the step is performed at a center part prior to an outer peripheral part of the top face.Type: GrantFiled: June 19, 2019Date of Patent: August 11, 2020Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Mikio Takigawa, Toshiyuki Terasawa
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Publication number: 20190299324Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material, the process comprising: a step of heating the top face of the target material by a hot plate while pressing from above thereby diffusion-bonding the target material to the backing plate material in such a manner that the step is performed at a center part prior to an outer peripheral part of the top face.Type: ApplicationFiled: June 19, 2019Publication date: October 3, 2019Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Mikio TAKIGAWA, Toshiyuki TERASAWA
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Patent number: 10369656Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material, the process comprising: a step of heating the top face of the target material by a hot plate while pressing from above thereby diffusion-bonding the target material to the backing plate material in such a manner that the step is performed at a center part prior to an outer peripheral part of the top face.Type: GrantFiled: July 10, 2017Date of Patent: August 6, 2019Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Mikio Takigawa, Toshiyuki Terasawa
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Publication number: 20180315586Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.Type: ApplicationFiled: July 10, 2017Publication date: November 1, 2018Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventor: Mikio TAKIGAWA
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Publication number: 20180304400Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material, the process comprising: a step of heating the top face of the target material by a hot plate while pressing from above thereby diffusion-bonding the target material to the backing plate material in such a manner that the step is performed at a center part prior to an outer peripheral part of the top face.Type: ApplicationFiled: July 10, 2017Publication date: October 25, 2018Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Mikio TAKIGAWA, Toshiyuki TERASAWA
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Publication number: 20180286646Abstract: A sputtering target comprising a target material, wherein a sputtering face of the target material has a ramp provided to reduce a thickness of the target material at a position where erosion concentrates most intensively during sputtering.Type: ApplicationFiled: March 26, 2018Publication date: October 4, 2018Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Toshiaki KURODA, Mikio TAKIGAWA
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Publication number: 20160343551Abstract: Objects of the present invention consist in achievement of both of elongation of life of a sputtering target as well as uniformity of a thickness of a resulting thin coating layer formed on a substrate during the period. The present invention provides a sputtering target comprising a target material, which is characterized in that the target material has a sputtering surface having a first area placed at the center, which is circular and flat; and a second area placed outside of the first area and concentrically with the first area, which has a ring shape, wherein the first area is positioned at a location lower than that of the second area by 15% of thickness of the second area at most, and the first area has a diameter which is ranging from 60% to 80% of a circumferential diameter of the sputtering surface.Type: ApplicationFiled: January 20, 2015Publication date: November 24, 2016Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Mikio TAKIGAWA, Toshiaki KURODA
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Patent number: 6914119Abstract: A heat-resistant polyether having a heat resistance to a temperature of 300° C. or higher, sufficient solubility in organic solvents, low water absorption and high adhesion to substrates is provided by a heat-resistant polyether including a repeating unit represented by the formula (1) and having a polystyrene-converted weight-average molecular weight determined by GPC of not less than 1000 and not more than 50000: wherein Ar represents a bivalent organic group having an aromatic ring; R1 to R8 each independently represent a hydrogen atom or an aryl group which may be substituted; and when at least one of R1 to R8 is an aryl group which may be substituted, X represents a direct bond or a hydrocarbon group having 1 to 20 carbon atoms, while when all of R1 to R8 are hydrogen atoms, X is represented by the formula (2): —CR9(R10)—??(2) wherein R9 and R10 each independently represent an aryl group which may be substituted.Type: GrantFiled: July 18, 2002Date of Patent: July 5, 2005Assignee: Sumitomo Chemical Company, LimitedInventors: Yuji Yoshida, Mikio Takigawa, Naoya Satoh
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Publication number: 20030060591Abstract: A heat-resistant polyether having a heat resistance to a temperature of 300° C.Type: ApplicationFiled: July 18, 2002Publication date: March 27, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Yuji Yoshida, Mikio Takigawa, Naoya Satoh