Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes an element, a coil formed in the element, terminals electrically connected to the coil, and magnetic layers arranged so as to be substantially parallel to a winding surface of the coil are formed in the element and the entirety of the magnetic layers is covered with a material of which thermal expansion and contraction rate is uniform.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes element (5), coil (6) formed in element (5), terminals (7, 8) electrically connected to coil (6), and magnetic layers (9A, 9B) arranged so as to be substantially parallel to a winding surface of coil (6) are formed in element (5) and entire magnetic layers (9A, 9B) is covered with a material of which thermal expansion and contraction rates are constant.

Abstract: There is provided an electronic component formed by adopting an adhesion reinforcement structure to an external electrode or the like, which is embedded in a protecting section made of a resin and part of which is exposed. Even when an external force is applied through the external electrode, the external force can be broadly dispersed all over a connecting section with the protecting section due to the adhesion reinforcement structure, to suppress an influence of the external force on a wiring, and whereby it is possible to omit a substrate that has been one of constitutional elements of a conventional electronic component, so as to realize reduction in height of the electronic component by the height of the substrate.

Abstract: Method of manufacturing a chip inductor including the steps of, a conductive layer forming process for forming conductive layer 4 on an outer periphery 2 and end surfaces 3 of a substrate 1, a coil portion forming process for forming coil portion 7 having conductor 5 and groove 6 by cutting spirally the conductive layer 4, an etching process for etching the substrate 1 having the coil portion 7 formed thereon; an insulation resin coating process for forming outer coating 8 by coating a surface of the conductive layer 4 with insulation resin 13; and an electrode forming process for forming electrodes 9 at both ends of the coil portion 7, and for making electric contacts between electrodes 9 and the conductive layer 4. A chip inductor having a flattened mounting surface of the outer coating is obtained when insulation resin layer 8 is formed by an electrodeposition method in the insulation resin coating process. The chip inductor can be securely mounted to a circuit board.

Abstract: Manufacturing method of the present invention comprises the steps of a conductive layer forming process for forming conductive layer 4 on outer periphery 2 and end surfaces 3 of substrate 1, a coil portion forming process for forming coil portion 7 having conductor 5 and groove 6 by cutting spirally the conductive layer 4, an etching process for etching the substrate 1 having the coil portion 7 formed thereon; an insulation resin coating process for forming outer coating 8 by coating a surface of the conductive layer 4 with insulation resin 13; and an electrode forming process for forming electrodes 9 at both ends of the coil portion 7, and for making electric contacts between electrodes 9 and the conductive layer 4. A chip inductor having a flattened mounting surface of the outer coating is obtained when insulation resin layer 8 is formed by an electrodeposition in the insulation resin coating process. The chip inductor can be securely mounted to a circuit board.

Abstract: The invention relates to a chip inductor and its manufacturing method, in which an appropriate insulation is applied between adjacent linear conductors of the coil unit to prevent occurrence of short-circuit and to enhance electric characteristics, and moreover the mounting surface by the exterior unit is a flat surface, so that appropriate mounting is realized. The constitution includes a square columnar main body (1) made of an insulating material, electrode units (6) disposed at both ends of this main body (1), a coil unit (5) connected to the electrode units (6) and disposed on the outer circumference of the main body (1) between the electrode units (6), and an exterior unit (9) having this coil unit (5) coated with an insulating resin (8), in which the coil unit (5) includes linear conductors (3) and grooves (4) formed by grooving a conductor layer (2) covering the surface of the main body (1), and the insulating resin (8) is also formed in the entire inside of the grooves (4).

Abstract: A chip inductor of a sealed type having a square-shaped winding comprises a bobbin for winding, which has a square-shaped flange on its both ends, and a metal terminal sticking out from the outer side surface of each respective flange and each respective metal terminal being bent inside each respective flange upward so as to stick out to the upper side surface of the flange, also have the foregoing metal terminal further bent along the upper side surface of the flange, and further make insert-molding of the foregoing bent terminal possible to form the bobbin for winding.

Abstract: The object of the present invention is to provide a chip inductor structured for miniaturization excellent mass-producibility and high reliability.A chip inductor of a sealed type having a square-shaped winding comprises a bobbin for winding, which has a square-shaped flange on its both ends, and a metal terminal sticking out from the outer side surface of each respective flange and each respective metal terminal being bent inside each respective flange upward so as to stick out to the upper side surface of the flange, also have the foregoing metal terminal further bent along the upper side surface of the flange, and further make insert-molding of the foregoing bent terminal possible to form the bobbin for winding.

Abstract: The invention relates to a chip inductor and its manufacturing method, in which an appropriate insulation is applied between adjacent linear conductors of the coil unit to prevent occurrence of short-circuit and to enhance electric characteristics, and moreover the mounting surface by the exterior unit is a flat surface, so that appropriate mounting is realized. The constitution includes a square columnar main body (1) made of an insulating material, electrode units (6) disposed at both ends of this main body (1), a coil unit (5) connected to the electrode units (6) and disposed on the outer circumference of the main body (1) between the electrode units (6), and an exterior unit (9) having this coil unit (5) coated with an insulating resin (8), in which the coil unit (5) includes linear conductors (3) and grooves (4) formed by grooving a conductor layer (2) covering the surface of the main body (1), and the insulating resin (8) is also formed in the entire inside of the grooves (4).

Abstract: The object of the present invention is to provide a chip inductor structured for miniaturization, excellent mass-producibility and high reliability.A chip inductor of a sealed type having a square-shaped winding comprises a bobbin for winding, which has a square-shaped flange on its both ends, and a metal terminal sticking out from the outer side surface of each respective flange and each respective metal terminal being bent inside each respective flange upward so as to stick out to the upper side surface of the flange, also have the foregoing metal terminal further bent along the upper side surface of the flange, and further make insert-molding of the foregoing bent terminal possible to form the bobbin for winding.

Abstract: The present invention relates to a chip coil for use in the electronic appliance or such other equipment, and intended to present a chip coil of an excellent mounting capability. Recesses (6) are provided only in the top and bottom surfaces of main body (1) having a square pillar shape, and in the bottom surface of main body (1) an insulation resin (4) is provided in the recess (6) to cover coil (2) within the space of recess (6).

Abstract: The object of the present invention is to provide a chip inductor structured for miniaturization, excellent mass-producibility and high reliability. The present invention discloses a chip inductor of a sealed type having a square-shaped winding comprising a bobbin a winding, which has a square-shaped flange on its both ends, and a metal terminal sticking out from the outer side surface of each respective flange with each respective metal terminal being bent inside each respective flange upward so as to stick out to the upper side surface of the flange, and also having the foregoing metal terminal further bent along the upper side surface of the flange, making it possible to insert mold the foregoing bent terminal forming the bobbin for a winding.

Abstract: A leadless chip inductor having metallic terminal plates and a coil element fixed to the metallic terminal plates, the metallic terminal plates being partially enclosed, together with the coil element, by a resin molded cover, the portions of the metallic terminal plates exposed to the outside of the molded outer cover being bent along the edge of the molded cover so as to form terminals for connection to an external circuit. The mechanical and electrical connection between the metallic terminal plates and the lead lines led from the coil is achieved by brazing or welding the lead lines to the undersides of a narrow strip-shaped tabs which is projected from each metallic terminal plate. With this arrangement, the coil lead lines are securely connected to the metallic terminal plates.