Patents by Inventor Mikko Tirkkonen

Mikko Tirkkonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Smart card web and a method for its manufacture
    Publication number: 20040112967
    Abstract: The present invention relates to a smart card web comprising a carrier web which comprises circuitry patterns, each having an integrated circuit at suitable spaces one after another and/or next to each other and at least one cover web attached to the carrier web. The carrier web and the cover web are attached by a thermoplastic adhesive bonding film web.
    Type: Application
    Filed: September 29, 2003
    Publication date: June 17, 2004
    Applicant: Rafsec Oy
    Inventors: Anu Krappe, Samuli Stromberg, Mikko Tirkkonen, Minna-Mari Reunanen
  • Method and an apparatus for manufacturing a smart label inlet web
    Publication number: 20030121986
    Abstract: In a method for the manufacture of a smart label inlet web, a surface web, a smart label web and a back web are attached to each other. Integrated circuits are attached in a continuous manner to each smart label of the smart label web before the webs are attached to each other on the same production line. The present invention also relates to a device for the manufacture of a smart label inlet web.
    Type: Application
    Filed: December 5, 2002
    Publication date: July 3, 2003
    Applicant: Rafsec Oy
    Inventors: Samuli Stromberg, Hanhikorpi Marko, Iikka Nuorela, Mikko Tirkkonen, Timo Lindstrom, Lari Kytola
  • Method for forming a product sensor
    Publication number: 20020047107
    Abstract: A method for making a product sensor by printing, preferably by serigraphy. Conductive ink is used, at least in part, in the printing. The product sensor is made by printing at least two conductive layers, with at least one insulating layer printed in between them. The invention further relates to a product package incorporating a product sensor with at least two conductive layers and at least one insulating layer formed in between them. At least one insulating layer is made by printing.
    Type: Application
    Filed: July 10, 2001
    Publication date: April 25, 2002
    Applicant: UPM-KYMMENE CORPORATION
    Inventors: Timo Lindstrom, Marko Hanhikorpi, Juhani Stromberg, Samuli Stromberg, Mikko Tirkkonen