Abstract: A system that uses one or more artificial intelligence models that predict an effect of a predicted event on a current state of the system. For example, the model may predict how a rate of change in time-series data may be altered throughout the first time period based on the predicted event.

Abstract: Systems and methods may use one or more artificial intelligence models that predict an effect of a predicted event on a current state of the system. The systems and methods may use one or more artificial intelligence models that predict an effect and/or occurrence of a predicted event based on the current state of the system. In order to generate responses that are both timely and pertinent (e.g., in a dynamic fashion), the system must determine, both quickly (i.e., in real-time or near real-time) and accurately, the predicted event.

Abstract: Embodiments include herein are directed towards a method for use in an electronic design environment is provided. Embodiments may include receiving, at a client electronic device, work instructions corresponding to an electronic circuit. Embodiments may further include displaying a graphical representation of the electronic circuit at a display screen associated with the client electronic device and displaying at least one instruction at the display screen, wherein displaying includes highlighting a component of the electronic circuit at the display screen.

Abstract: The systems and methods may use one or more artificial intelligence models that predict an effect of a predicted event on a current state of the system. For example, the model may predict how a rate of change in time-series data may be altered throughout the first time period based on the predicted event.

Abstract: The present disclosure relates to a system and method for optimizing switching of a DRAM bus using LLC. An embodiment of the disclosure includes sending a first type request from a first type queue to the second memory via the memory bus if a direction setting of the memory bus is in a first direction corresponding to the first type request, decrementing a current direction credit count by a first type transaction decrement value, if the decremented current direction credit count is greater than zero, sending another first type request to the second memory via the memory bus and decrementing the current direction credit count again by the first type transaction decrement value, and if the decremented current direction credit count is zero, switching the direction setting of the memory bus to a second direction and resetting the current direction credit count to a second type initial value.

Abstract: Embodiments include herein are directed towards a method for use in an electronic design environment is provided. Embodiments may include receiving, at a client electronic device, an image of an electronic circuit and storing an electronic circuit design file. Embodiments may further include identifying the electronic circuit design file based upon, at least in part, the image of the electronic circuit. Embodiments may also include displaying a graphical representation of the electronic circuit at a display screen associated with the client electronic device.

Abstract: The present disclosure relates to a system and method for optimizing switching of a DRAM bus using LLC. An embodiment of the disclosure includes sending a first type request from a first type queue to the second memory via the memory bus if a direction setting of the memory bus is in a first direction corresponding to the first type request, decrementing a current direction credit count by a first type transaction decrement value, if the decremented current direction credit count is greater than zero, sending another first type request to the second memory via the memory bus and decrementing the current direction credit count again by the first type transaction decrement value, and if the decremented current direction credit count is zero, switching the direction setting of the memory bus to a second direction and resetting the current direction credit count to a second type initial value.

Abstract: An elastomeric sealing device operable at an operating temperature above an installation temperature. The sealing device includes a body fabricated from an elastomeric material. A channel is formed within the body. A mesh is disposed within the channel. The mesh includes a plurality of interwoven fibers forming an inner volume. A filler is disposed within the inner volume. At least a portion of the filler is a liquid at the installation temperature. The at least a portion of the filler is a gas at the operating temperature.

Abstract: An Advanced Microcontroller Bus Architecture (AMBA)/Advanced eXtensible Interface (AXI) compatible device and corresponding method capable of efficient reordering of responses from a last level cache (LLC) and/or dynamic random access memory (DRAM).

Abstract: An Advanced Microcontroller Bus Architecture (AMBA)/Advanced eXtensible Interface (AXI) compatible device and corresponding method capable of efficient reordering of responses from a last level cache (LLC) and/or dynamic random access memory (DRAM).

Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract: An elastomeric sealing device operable at an operating temperature above an installation temperature. The sealing device includes a body fabricated from an elastomeric material. A channel is formed within the body. A mesh is disposed within the channel. The mesh includes a plurality of interwoven fibers forming an inner volume. A filler is disposed within the inner volume. At least a portion of the filler is a liquid at the installation temperature. The at least a portion of the filler is a gas at the operating temperature.

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract: Systems and methods for efficient data transfer in a data processing system that includes saving and restoring residual data of a write gather facility. Specifically, a method is provided for data processing that includes writing an address to a register. The method further includes initiating a save operation of residual data within the write gather facility. The writing of the address to the register causes the initiation of the save operation. The residual data is one byte to any number of bytes less than a predetermined number of bytes gathered in the write gather facility.

Abstract: Various injector cooling structures and related engine systems and methods are provided. In one example, an injector cooling structure includes a cooling channel defined by a cooling jacket of a turbine. A cooling bore is provided at least partially within the cooling jacket, with the cooling bore configured to receive a pintle of an injector. The cooling channel is configured to circulate coolant for cooling the injector.

Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.