Abstract: A ladder. A step is coupled to a primary leg, an adjustable base is coupled to the primary leg, the adjustable base includes a first base section rotatably coupled to a second base section and the second base section is coupled to the primary leg. An adjuster retains the first base section at one of a plurality of rotations with respect to the second base section. In implementations a secondary leg is coupled to the primary leg proximate a top of the ladder and a movable section is coupled to the primary leg with an arm and further coupled to the secondary leg with an arm, the movable section having a substantially planar upper surface configured to generally face the top of the ladder when the ladder is in an open configuration and configured to generally face the top of the ladder when the ladder is in a closed configuration.

Abstract: A electronic apparatus and a process for its manufacture are disclosed. The apparatus includes a planar card for accommodating an electronics module package having protruding solder columns and solder joints to mechanically mount and electrically connect the solder columns of the module to the planar card. The planar card includes a first side and a second side, a plurality of wiring lines forming a wiring pattern, and a plurality of vias extending at least partially through the card. Each of the vias includes at least one recessed area extending from one or both sides of the card. The recessed areas extending to a depth within the planar card sufficient to wick the solder joints, and the each of the recessed areas are shaped to provide surface tension to mechanically retain the solder joints.

Abstract: A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.

Abstract: A system for removing protective coatings from a circuit board assembly. The system includes a tool for removing protective coatings from a circuit board assembly. The tool has a flow head, which includes a support, having an opening which is adapted to contact the circuit board assembly and flow solvent to the surface of the circuit board. The flow head may also include a solvent nozzle positioned within the support. The solvent nozzle has an opening adapted to apply solvent to the circuit board assembly. The flow head also includes a solvent recovery volume positioned beneath the support and adjacent to the nozzle. The system also includes a second solvent reservoir, a mechanism for applying heat to the reservoir, and a mechanism for circulating solvent from the reservoir to the flow head and back to the reservoir.

Abstract: An electrical connector system uses two electrical connector housings and two mating electrical connectors. The electrical connector housings are disposed on a support plate in an end to end relation and spaced apart by a distance smaller than twice the distance from the electrical connector housing to the fastener holding the connector to the connector housing. The fasteners are carried by and engaged with a retainer bar that further engages the connectors to pull the connectors into the connector housings and retain them in connection relationship, ensuring reliability of the connection.

Abstract: A electronic apparatus and a process for its manufacture are disclosed. The apparatus includes a planar card for accommodating an electronics module package having protruding solder columns and solder joints to mechanically mount and electrically connect the solder columns of the module to the planar card. The planar card includes a first side and a second side, a plurality of wiring lines forming a wiring pattern, and a plurality of vias extending at least partially through the card. Each of the vias includes at least one recessed area extending from one or both sides of the card. The recessed areas extending to a depth within the planar card sufficient to wick the solder joints, and the each of the recessed areas are shaped to provide surface tension to mechanically retain the solder joints.