Abstract: A pressure transducer which has a housing containing a sensing element and a noncorrosive fluid in contact with the sensing element. A porous material isolates the fluid from a harsh liquid or a liquid containing solids while allowing transmission of the pressure of the liquid.

Abstract: A pressure transmitter comprises a first housing having a first and second diaphragm for receiving a first and second process fluid under a first and second pressure, respectively. The first and second diaphragm is deflected in response to the first and second pressure of the process fluid. A second housing includes a printed wire board. A first and second capillary tube is included, the first capillary tube being operatively coupled to the first diaphragm and the second capillary tube being operatively coupled to the second diaphragm, each corresponding capillary tube having an internal fluid therein. A sensor package, having a sensor element, is mounted internally within the second housing, and is coupled to the first and second capillary tubes such that the sensor element provides a first signal which is coupled to electrical circuit components mounted on the printed wire board to output a signal representative of the differential pressure of the process fluid.

Abstract: A wet-to-wet pressure sensor package (10) having a housing (12) with a pressure sensitive semiconductor die (34) supported within a resilient mounting (44) including continuous beads (46, 48) of elastomeric adhesive on the same portion of the housing to provide a protective seal with less stress so that improved sensitivity and repeatability of the wet-to-wet pressure sensor is achieved.

Abstract: A sleeveless glass to metal solder joint wherein the glass is coated with a solder wetable metal. The invention is particularly useful in high pressure environments or as part of a pressure sensor assembly which includes a silicon based pressure sensor.

Abstract: An absolute pressure transducer includes a hollow glass tube supporting across one end thereof a differential pressure responsive semiconductor plate having piezoresistive elements diffused therein and an evacuated sealed chamber within the tube exposed to the plate. A method for making the transducer and providing the evacuated chamber within the tube adjacent to the plate includes the steps of mounting the plate across the end of the tube to form a first fluid-tight seal therewith, inserting a loose glass plug within the tube to define the chamber, exposing the interior of the tube to a vacuum, concurrently heating the tube in the vicinity of the plug to allow the heated tube wall to constrict around the plug in response to the internal vacuum and to fuse with the plug to form a second fluid-tight seal therewith and allowing the tube and plug to cool to trap the vacuum in the chamber.