Patents by Inventor Min-Chian WANG

Min-Chian WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D SCANNING SYSTEM AND METHOD
    Publication number: 20240168168
    Abstract: A three-dimensional (3D) scanning system includes a projector that generates an emitted light projected on an object, a reflected light being reflected from the object; a sensor that generates image data according to the reflected light; and a depth processor that generates depth data according to the image data and at least one modified factor representing corresponding deviation amount between the image data and an ideal image data due to a circle of confusion caused by the reflected light passing a lens of the sensor and then irradiating a sense plane of the sensor out of focus.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Min-Chian Wu, Ting-Sheng Hsu, Ching-Wen Wang, Cheng-Che Tsai
  • Three-dimensional sensing system
    Patent number: 11915512
    Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 27, 2024
    Assignee: Himax Technologies Limited
    Inventors: Ching-Wen Wang, Cheng-Che Tsai, Ting-Sheng Hsu, Min-Chian Wu
  • Resin composition and method for manufacturing thermally conductive material
    Patent number: 11015018
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 25, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • RESIN COMPOSITION AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL
    Publication number: 20190211138
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 11, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun LIU, Min-Chian WANG, Hsiang-Yen TSAO, Kuo-Chan CHIOU
  • Thermally conductive resin and thermal interface material comprising the same
    Patent number: 10329468
    Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 25, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Hui-Wen Chang, Min-Chian Wang, Kuo-Chan Chiou
  • THERMALLY CONDUCTIVE RESIN AND THERMAL INTERFACE MATERIAL COMPRISING THE SAME
    Publication number: 20170158934
    Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
    Type: Application
    Filed: February 18, 2016
    Publication date: June 8, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun LIU, Hui-Wen CHANG, Min-Chian WANG, Kuo-Chan CHIOU