Abstract: A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

Abstract: A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

Abstract: A method of fabricating a multi-layer electric probe. The method includes forming a first strip layer. The first strip layer has a first conductivity and a first mechanical strength. Then, a second strip layer is solidly adhered to a surface of the first strip layer to form a structural body, wherein the second strip layer has a second conductivity and a second mechanical strength. The combination of the second conductivity and the second mechanical strength with the first conductivity and the first mechanical strength produces the desired capabilities of enduring current and mechanical strength.

Abstract: A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump.

Abstract: A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least a substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni—Co alloy.

Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: The present invention discloses a method for manufacturing a roller with microstructure, comprising the steps of: forming a protective metal layer on a roller; defining specific imprint patterns on an imprint stamp by processing the imprint stamp with a flexible mold; forming an etch mask on the embossed imprint stamp after the imprint stamp is released from the mold; wetting the imprint stamp and the etch mask thereof; adhering the etch mask onto the roller by rolling the roller on the imprint stamp; etching the roller at the portion thereof uncovered by the etch mask; and forming the roller with specific microstructure by removing the etch mask and the protective metal layer.

Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

Abstract: A probe module which is particularly suitable for testing an LCD panel. The probe module includes a probe base, a plurality of probe pins provided on the probe base, and a high-density circuit interconnection which includes a flexible circuit board that connects the probe pins to a testing apparatus. The tip of each probe pin may have a pointed or tapered configuration, or alternatively, a hemi-spherical configuration.

Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: The present invention relates to a beam modulating apparatus for mold fabrication by ultra-fast laser technique. More particularly, the present invention discloses a beam modulating apparatus for fabricating micro-/nano-scaled structures, which adopts an energy shaping scheme for beam shape modulation while using the modulated beam for mold fabrication. Following the development of flexible electronic devices, such as flexible displays, all kinds of roller molds formed with micro-/nano-scaled structures are becoming the key issue for commercialization and mass production which require a breakthrough in ultra-precision machining and photo-lithography that overcomes the bottlenecks related to shape, size, thermal effect and precision for fabricating sub-micron sized structures and thus greatly enhancing product design capability and functionality.

Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least an substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni—Co alloy.

Abstract: The present invention relates to a method of fabricating a vertical probe head, whereas the vertical probe head is formed by the combination of at least a probe, a bottom guide plate and a top guide plate having at least a hole matching the probe. The probe is fabricated by a LIGA-like process combining with the processes of photolithography, etching and electroforming, and so on, so that the probe is equipped with comparatively better precision, strength and reliability and yet can be custom-made for satisfying various demands. In addition, both the top and bottom guide plates are made by a means of non-mechanical machining, which respectively is fabricated by processing a substrate using means of photolithography, etching and mask so as to fabricate holes for matching with the aforesaid probe.

Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: The present invention discloses a method for manufacturing a roller with microstructure, comprising the steps of: forming a protective metal layer on a roller; defining specific imprint patterns on an imprint stamp by processing the imprint stamp with a flexible mold; forming an etch mask on the embossed imprint stamp after the imprint stamp is released from the mold; wetting the imprint stamp and the etch mask thereof; adhering the etch mask onto the roller by rolling the roller on the imprint stamp; etching the roller at the portion thereof uncovered by the etch mask; and forming the roller with specific microstructure by removing the etch mask and the protective metal layer.

Abstract: An integrated complex nano probe card is disclosed to include a substrate layer having a front side and a back side, and complex probe pins arranged in the substrate layer. Each complex probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each complex probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Abstract: A multi-layer electric probe, suitable for testing a to-be-tested device, includes a first strip layer and a second strip layer. The first strip layer has a first conductivity and a first mechanical strength. The second strip layer has a second conductivity and a second mechanical strength. The first strip layer and the second strip layer are solidly adhered together as a structural body so as to produce at least one of the desired capabilities of enduring current and mechanical strength. The multi-layer electric probe can further include at least a third strip layer having the capability of enduring current and the desired mechanical strength.