Abstract: A conductive structure includes a wafer having a scribe line defined thereon, at least a first wiring layer formed in the scribe line, and at least a via layer disposed in the scribe line and under the wiring layer. The first wiring layer includes a main pattern and the via layer includes a closed frame pattern corresponding to the main pattern of the first wiring layer.

Abstract: A utensil for conventional heating and microwave heating comprises a base coated with a microwave absorbing coating made of refractory material. The base of the utensil is made of metal and the microwave absorbing coating has a high thermal conductivity. The body of the utensil is fully or partially coated with the microwave absorbing coating. The microwave absorbing coating can absorb thermal energy of a conventional heating oven or can absorb the microwaves of a microwave heating oven, and then turn the microwaves into heat energy and transmit the heat energy to the base of the utensil, thus heating the food from outside in.

Abstract: A metal container processing method includes steps of: a) stamping a metal sheet material into a blank container subject to the desired shape, b) removing sharp burrs and dents from the surface of the metal sheet material of the blank container with sodium nitrite solution, c) covering the surface of the metal sheet material of the blank container with a layer of surface coating of phosphorous compound, and d) covering said layer of surface coating with a layer of heat insulation coating containing Teflon and heat insulating material at the ratio of about 100:25˜35%.