Abstract: Embodiments of the present disclosure provide method and apparatus for rate control. A method performed by a first terminal device comprises receiving at least one bit rate limitation from a network device. The method further comprises applying the at least one bit rate limitation. A relay terminal device is used to relay communication between the first terminal device and a data network.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: An electronic package is provided, in which a first electronic element and a second electronic element stacked on each other are embedded in a cladding layer, a circuit structure electrically connected to the second electronic element is formed on the cladding layer, and a passive element and a package module are disposed on the circuit structure, so as to shorten the transmission distance of electrical signals between the package module and the second electronic element.

Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.

Abstract: A method of forming a semiconductor device includes: forming a gate structure over a fin that protrudes above a substrate; forming source/drain regions over the fin on opposing sides of the gate structure; forming a first dielectric layer and a second dielectric layer successively over the source/drain regions; performing a first etching process to form an opening in the first dielectric layer and in the second dielectric layer, where the opening exposes an underlying electrically conductive feature; after performing the first etching process, performing a second etching process to enlarge a lower portion of the opening proximate to the substrate; and forming a contact plug in the opening after the second etching process.

Abstract: Provided herein is a potassium-binding polymer prepared by polymerization reaction of a monomer and a crosslinking agent, wherein the monomer is the compound of formula (V), the crosslinking agent is the compound of formula (VI), and/or the compound of formula (VII), wherein the variables are as defined in the specification; to the use thereof for treating or preventing hyperkalemia.

Abstract: A technique for forwarding a mobility update report from a remote radio device (100-RM) that is in relayed radio communication with a radio access network, RAN (530), through a relay radio device (100-RL; 1100; 1391; 1392; 1430), is described. The remote radio device (100-RM) is in a first radio resource control, RRC, state (502-RM) relative to the RAN (530), and the relay radio device (100-RL; 1100; 1391; 1392; 1430) is in a second RRC state (502-RL) relative to the RAN (530), wherein the first RRC state is different from the second RRC state. As to a method aspect of the technique, the method (300-RL) performed by the relay radio device (100-RL; 1100; 1391; 1392; 1430) comprises or initiated the step of receiving (302-RL) the mobility update report from the remote radio device (100-RM) on a sidelink, SL, between the remote radio device (100-RM) and the relay radio device (100-RL; 1100; 1391; 1392; 1430), the mobility update report being indicative of a mobility update of the remote radio device (100-RM).

Abstract: Various embodiments of the present disclosure provide a method for relay service code management. The method which may be performed by a user equipment comprises transmitting a message to a first network to request a relay service code. In accordance with an exemplary embodiment, the method further comprises receiving a response to the message from the first network. The response to the message may include the RSC.

Abstract: A method includes transcoding a first block from a spatial region. The first block is associated with a first block tree pattern defining a structure of splitting a block into smaller blocks. A bit string of bits for the first block tree pattern is included in an encoded bitstream. The method determines a location of the first block in the spatial region when the first block tree pattern of the first block can be reused for a second block tree pattern of a second block. The spatial region includes blocks and the location is based on the first block being in the spatial region. Information for the second block is included in the encoded bitstream that indicates the location of the first block in the spatial region. The location allows the bit string for the first block tree pattern to be retrieved for use to decode the second block.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: Various embodiments of the present disclosure provide a method for relay (re) selection. The method which may be performed by a first terminal device comprises generating a message targeting at least a second terminal device. In accordance with an exemplary embodiment, the message may include an indicator used to determine which of the first terminal device and the second terminal device is to perform relay selection or reselection. The method further comprises transmitting the message towards the second terminal device.

Abstract: Provided are a response receiving and sending method, a retransmission method, a communication device, and a storage medium. The method includes: sending a transport block to a first communication device through a pre-configured period resource, and receiving a correct response corresponding to the transport block on a pre-configured correct response resource.

Abstract: A method of forming a semiconductor device includes: forming a gate structure over a fin that protrudes above a substrate; forming source/drain regions over the fin on opposing sides of the gate structure; forming a first dielectric layer and a second dielectric layer successively over the source/drain regions; performing a first etching process to form an opening in the first dielectric layer and in the second dielectric layer, where the opening exposes an underlying electrically conductive feature; after performing the first etching process, performing a second etching process to enlarge a lower portion of the opening proximate to the substrate; and forming a contact plug in the opening after the second etching process.

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.

Abstract: A chamber for processing deposition on a wafer includes a wafer holder having a central surface region for placing a wafer and a carrier ring support surface encircling the central surface region; and a carrier ring disposed on the carrier ring support surface. The carrier ring comprises an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region between the annular wafer support region and the annular peripheral region. The annular peripheral region comprises a top carrier ring surface. The annular wafer support region has a lower carrier ring surface that is in physical contact with a wafer during processing. The annular transition region comprises a curved slope between the top carrier ring surface and the lower carrier ring surface.

Abstract: A motor and a rotor structure thereof are disclosed. The rotor structure includes a rotor core. The rotor core has a plurality of magnetic member units arranged around a periphery of the rotor core. Each magnetic member unit includes two first magnetic members and a second magnetic member. The two first magnetic members are obliquely arranged in a V shape relative to a center of the rotor core. The second magnetic member extends transversely between the two first magnetic members. Each first magnetic member has at least two permanent magnets that are arranged obliquely. The motor further includes a stator core covering the rotor core. The stator core has a plurality of stator windings arranged annularly. The stator windings correspond to the magnetic member units. The rotor structure has high structural strength, and the phenomenon of stress concentration is less obvious when the motor is running.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.