Patents by Inventor Min Ho Bak

Min Ho Bak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9333594
    Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 10, 2016
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Korea Autoglass Corporation, Heesung Material Ltd.
    Inventors: Hae Won Jeong, Hyun Dal Park, Tae Seung Lee, Seung Kyu Kim, Hong Nho Joo, Ho June Yoon, Min Ho Bak, Joo Dong Lee, Hyun Chae Jung, Sun Myung Lee
  • Publication number: 20140044589
    Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
    Type: Application
    Filed: December 12, 2012
    Publication date: February 13, 2014
    Applicants: HYUNDAI MOTOR COMPANY, HEESUNG MATERIAL LTD., KOREA AUTOGLASS CORPORATION, KIA MOTORS CORPORATION
    Inventors: Hae Won Jeong, Hyun Dal Park, Tae Seung Lee, Seung Kyu Kim, Hong Nho Joo, Ho June Yoon, Min Ho Bak, Joo Dong Lee, Hyun Chae Jung, Sun Myung Lee