Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.

Abstract: A method includes forming a transistor, which includes forming a dummy gate stack over a semiconductor region, and forming an Inter-Layer Dielectric (ILD). The dummy gate stack is in the ILD, and the ILD covers a source/drain region in the semiconductor region. The method further includes removing the dummy gate stack to form a trench in the first ILD, forming a low-k gate spacer in the trench, forming a replacement gate dielectric extending into the trench, forming a metal layer to fill the trench, and performing a planarization to remove excess portions of the replacement gate dielectric and the metal layer to form a gate dielectric and a metal gate, respectively. A source region and a drain region are then formed on opposite sides of the metal gate.

Abstract: A semiconductor device assembly is provided. The assembly includes a package substrate which has a tunneled interconnect structure. The tunneled interconnect structure has a solder-wettable surface, an interior cavity, and at least one microvia extending from the surface to the cavity. The assembly further includes a semiconductor device disposed over the substrate and a solder joint coupling the device and the substrate. The joint comprises the solder between the semiconductor device and the interconnect structure, which includes the solder on the surface, the solder in the microvia, and the solder within the interior cavity.

Abstract: A power supply applied to an electronic device for providing power includes a transformer unit, a connector, a pulse-width modulation (PWM) control unit, and a switch unit. The connector is electrically connected with the secondary side of the transformer unit for outputting a first output voltage. The PWM control unit outputs a pulse signal with a first period. The switch unit is electrically connected between the PWM control unit and the primary side of the transformer unit. When the electronic device is connected to the power supply, the connector receives an external control signal, and the PWM control unit adjusts the pulse width of the pulse signal to a second period and transmits the pulse signal with the second period to the switch unit to control the connector to output a second output voltage to the electronic device.

Abstract: A connector module includes a first connector, a first electrode, a second connector and a second electrode. The first connector has a plug hole. The first electrode is disposed in the plug hole. The second connector has a connecting portion. A projecting area of the connecting portion is larger than that area of the plug hole. The second electrode is disposed at the connecting portion. When the connecting portion is disposed in the first connector, the first electrode contacts the second electrode and an inner wall of the plug hole restrains the connecting portion from detaching from the plug hole. An electronic device with the connector module is also disclosed herein.

Abstract: A power supply applied to an electronic device for providing power includes a transformer unit, a connector, a pulse-width modulation (PWM) control unit, and a switch unit. The connector is electrically connected with the secondary side of the transformer unit for outputting a first output voltage. The PWM control unit outputs a pulse signal with a first period. The switch unit is electrically connected between the PWM control unit and the primary side of the transformer unit. When the electronic device is connected to the power supply, the connector receives an external control signal, and the PWM control unit adjusts the pulse width of the pulse signal to a second period and transmits the pulse signal with the second period to the switch unit to control the connector to output a second output voltage to the electronic device.

Abstract: A connector module includes a first connector, a first electrode, a second connector and a second electrode. The first connector has a plug hole. The first electrode is disposed in the plug hole. The second connector has a connecting portion. A projecting area of the connecting portion is larger than that area of the plug hole. The second electrode is disposed at the connecting portion. When the connecting portion is disposed in the first connector, the first electrode contacts the second electrode and an inner wall of the plug hole restrains the connecting portion from detaching from the plug hole. An electronic device with the connector module is also disclosed herein.

Abstract: A power system includes an electronic device having a host and a state generator and an adaptor. The host is capable of presenting a plurality of states and generating a plurality of state signals corresponding to the states, and the state generator is electrically connected to the host, receives the state signals and generates a control signal accordingly. The adaptor is connected to an AC voltage and has a state receiving terminal to receive the control signal. The adaptor is capable of generating a DC voltage to the electronic device according to the control signal.

Abstract: A cable collector of a power supply apparatus is provided. The power supply apparatus includes a power adaptor, a cable, and a cable collector. One side of the cable is connected with the power adaptor. The cable collector includes a first board, a first power connector, and two first blocking boards. The first board is connected with a first surface of the power adaptor. The first power connector is formed on the first board. The first board is connected with the power adaptor via the first power connector. The two first blocking boards are formed on two sides of the first board.

Abstract: A cable collector of a power supply apparatus is provided. The power supply apparatus includes a power adaptor, a cable, and a cable collector. One side of the cable is connected with the power adaptor. The cable collector includes a first board, a first power connector, and two first blocking boards. The first board is connected with a first surface of the power adaptor. The first power connector is formed on the first board. The first board is connected with the power adaptor via the first power connector. The two first blocking boards are formed on two sides of the first board.

Abstract: A power detection jack can be connected with a plurality of power output jacks respectively to receive different power levels. Each of the power output jacks has a first insulation element, and the lengths of the first insulation elements are different from each other. The power detection jack includes a first electrode, a second electrode and a power detection element. The first electrode is disposed inside the power detection jack. The second electrode is disposed outside the power detection jack. The power detection element is disposed between the first electrode and the second electrode. When the power detection jack is connected with one of the power output jacks, the power level provided by the power output jack is determined according to a connection state of the power detection element and the first insulation element.