Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: A light emitting device package of one embodiment includes a base, a light emitting device disposed on the base and having a first refractive index, a wavelength conversion portion disposed on the light emitting device and having a second refractive index, and a buffering layer disposed between the light emitting device and the wavelength conversion portion and having a third refractive index between the first refractive index and the second refractive index.

Abstract: A back light unit includes a bottom cover, a plurality of light source modules mounted on the bottom cover, and an optical sheet unit over the light source modules, wherein each of the light source module includes a PCB having the plurality of light source modules mounted thereon, a diffusing plate spaced a distance from the LED light sources and surrounding the PCB fully for diffusing a light incident thereon from the LED light sources throughout a surface thereof uniformly, and a diffusing plate supporter for securing the diffusing plate to the PCB, and the diffusing plate includes a flat plate portion, a side wall portion extended from opposite edges of the plate portion to the diffusing plate supporter, and a plurality of light diffusing units each projected from a surface facing the LED light source on the plate portion at a position matched to the LED light source, thereby enabling to make effective response to fabrication of thinner liquid crystal display device and improve a light uniformity, and impr

Abstract: A back light unit includes a bottom cover, a plurality of light source modules mounted on the bottom cover, and an optical sheet unit over the light source modules, wherein each of the light source module includes a PCB having the plurality of light source modules mounted thereon, a diffusing plate spaced a distance from the LED light sources and surrounding the PCB fully for diffusing a light incident thereon from the LED light sources throughout a surface thereof uniformly, and a diffusing plate supporter for securing the diffusing plate to the PCB, and the diffusing plate includes a flat plate portion, a side wall portion extended from opposite edges of the plate portion to the diffusing plate supporter, and a plurality of light diffusing units each projected from a surface facing the LED light source on the plate portion at a position matched to the LED light source, thereby enabling to make effective response to fabrication of thinner liquid crystal display device and improve a light uniformity, and impr