Patents by Inventor Min Jui Wu

Min Jui Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING A HEAT DISSIPATING STRUCTURE
    Publication number: 20120279040
    Abstract: A forming method for a heat dissipating structure is provided. According to the method, an extrudate is formed by extrution molding, wherein the extrudate includes protruding bending portions extending in parallel. Fins are extruded monolithically on the bending portions. One or more cut channels are formed by cutting the fins and the extrudate with a cutting tool. The cutting tool cuts the fins for forming a notch on each fin at first, and then cuts the bending portions for forming a cut-through slot on each bending portion, wherein each cut-through slot is formed for cooling air flowing through two side of the extrudate. By cutting the bending portions and the fins by the cutting tool at the same time, a large number of cut-through slots are formed in despite of the existence of the fins, and the performance of heat dissipation is enhanced.
    Type: Application
    Filed: July 20, 2012
    Publication date: November 8, 2012
    Applicant: MITAC TECHNOLOGY CORP.
    Inventors: Ting Wei Liang, Min Jui Wu
  • Heat dissipating structure and method of forming the same
    Patent number: 8297341
    Abstract: A forming method for a heat dissipating structure is provided. According to the method, an extrudate is formed by extrution molding, wherein the extrudate includes protruding bending portions extending in parallel. Fins are extruded monolithically on the bending portions. One or more cut channels are formed by cutting the fins and the extrudate with a cutting tool. The cutting tool cuts the fins for forming a notch on each fin at first, and then cuts the bending portions for forming a cut-through slot on each bending portion, wherein each cut-through slot is formed for cooling air flowing through two side of the extrudate. By cutting the bending portions and the fins by the cutting tool at the same time, a large number of cut-through slots are formed in despite of the existence of the fins, and the performance of heat dissipation is enhanced.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: October 30, 2012
    Assignee: Getac Technology Corp.
    Inventors: Ting Wei Liang, Min Jui Wu
  • HEAT DISSIPATING STRUCTURE AND METHOD OF FORMING THE SAME
    Publication number: 20100059213
    Abstract: A forming method for a heat dissipating structure is provided. According to the method, an extrudate is formed by extrution molding, wherein the extrudate includes protruding bending portions extending in parallel. Fins are extruded monolithically on the bending portions. One or more cut channels are formed by cutting the fins and the extrudate with a cutting tool. The cutting tool cuts the fins for forming a notch on each fin at first, and then cuts the bending portions for forming a cut-through slot on each bending portion, wherein each cut-through slot is formed for cooling air flowing through two side of the extrudate. By cutting the bending portions and the fins by the cutting tool at the same time, a large number of cut-through slots are formed in despite of the existence of the fins, and the performance of heat dissipation is enhanced.
    Type: Application
    Filed: September 8, 2008
    Publication date: March 11, 2010
    Applicant: MITAC TECHONOLOGY CORP.
    Inventors: Ting Wei Liang, Min Jui Wu