Abstract: The present technology provides a method of manufacturing a semiconductor device. The method includes forming a preliminary source structure, forming a stack structure on the preliminary source structure, the stack structure including a first material layer and a second material layer, forming a preliminary memory layer that penetrates the stack structure, forming a trench passing through the stack structure, forming a first buffer pattern by performing a surface treatment on a portion of the second material layer that is exposed by the trench, and forming a protective layer covering the first buffer pattern.

Abstract: The present technology provides a method of manufacturing a semiconductor device. The method includes forming a preliminary source structure, forming a stack structure on the preliminary source structure, the stack structure including a first material layer and a second material layer, forming a preliminary memory layer that penetrates the stack structure, forming a trench passing through the stack structure, forming a first buffer pattern by performing a surface treatment on a portion of the second material layer that is exposed by the trench, and forming a protective layer covering the first buffer pattern.

Abstract: A method of manufacturing a semiconductor device includes forming a preliminary source structure including a source sacrificial layer and an upper source layer, forming a hole in the preliminary source structure, forming a preliminary memory layer on a surface of the hole, forming a channel layer on the preliminary memory layer, forming a trench passing through the upper source layer, forming a first buffer pattern by performing a surface treatment on a side portion of the upper source layer exposed by the trench, forming a cavity exposing a portion of the preliminary memory layer by removing the source sacrificial layer, forming an expanded cavity exposing a portion of the channel layer by removing the portion of the preliminary memory layer, and forming a source layer in the expanded cavity.

Abstract: The present technology provides a method of manufacturing a semiconductor device. The method includes forming a preliminary source structure, forming a stack structure on the preliminary source structure, the stack structure including a first material layer and a second material layer, forming a preliminary memory layer that penetrates the stack structure, forming a trench passing through the stack structure, forming a first buffer pattern by performing a surface treatment on a portion of the second material layer that is exposed by the trench, and forming a protective layer covering the first buffer pattern.

Abstract: The present technology provides a method of manufacturing a semiconductor device. The method includes forming a preliminary source structure, forming a stack structure on the preliminary source structure, the stack structure including a first material layer and a second material layer, forming a preliminary memory layer that penetrates the stack structure, forming a trench passing through the stack structure, forming a first buffer pattern by performing a surface treatment on a portion of the second material layer that is exposed by the trench, and forming a protective layer covering the first buffer pattern.

Abstract: The present technology provides a method of manufacturing a semiconductor device. The method includes forming a preliminary source structure, forming a stack structure on the preliminary source structure, the stack structure including a first material layer and a second material layer, forming a preliminary memory layer that penetrates the stack structure, forming a trench passing through the stack structure, forming a first buffer pattern by performing a surface treatment on a portion of the second material layer that is exposed by the trench, and forming a protective layer covering the first buffer pattern.

Abstract: Disclosed is a system for moving substrates in and out of a manufacturing process.

Abstract: Disclosed is a system for moving substrates in and out of a manufacturing process.

Abstract: Disclosed is an in-line apparatus system that comprises a plurality of sub-apparatuses, a host, a plurality of apparatus controllers, and a master controller. The sub-apparatuses perform predetermined jobs on the substrates. The host stores information on the substrate to be processed in the sub-apparatuses and information on jobs performed by the sub-apparatuses. The apparatus controllers respectively control substrate jobs in the sub-apparatuses according to the information on the substrates and jobs, and are interconnected through a network and share information on the substrates. The master controller, connected to the apparatus controllers, controls the apparatus controllers and receives job information of the sub-apparatuses from the apparatus controllers and transmits the job information to the host. The in-line apparatus system and its control method enable overall easy control and increase reliability.

Abstract: Disclosed are a system for workpiece cutting and sorting automation, and a method for controlling the system. The system includes a cutting/sorting equipment for cutting a substrate having a plurality of cells into cut substrates, and sorting the cut substrates according to a predetermined mode; and a system controller for receiving a request for operation information on the cut substrates from the cutting/sorting equipment, and transmitting the operation information and operation commands to the cutting/sorting equipment. The method includes the steps of (a) determining an operating mode of the cut substrates; (b) sorting the cut substrates and supplying the sorted cut substrates to one of the plurality of cassettes according to the operating mode of the cut substrates determined in step (a); and (c) repeating steps (a) and (b) for a predetermined lot number of cut substrates.

Abstract: Disclosed is a system for moving substrates in and out of a manufacturing process.

Abstract: Disclosed are a system for workpiece cutting and sorting automation, and a method for controlling the system. The system includes a cutting/sorting equipment for cutting a substrate having a plurality of cells into cut substrates, and sorting the cut substrates according to a predetermined mode; and a system controller for receiving a request for operation information on the cut substrates from the cutting/sorting equipment, and transmitting the operation information and operation commands to the cutting/sorting equipment. The method includes the steps of (a) determining an operating mode of the cut substrates; (b) sorting the cut substrates and supplying the sorted cut substrates to one of the plurality of cassettes according to the operating mode of the cut substrates determined in step (a); and (c) repeating steps (a) and (b) for a predetermined lot number of cut substrates.

Abstract: Disclosed is an automation system and a method for assembling a workpiece. The system includes a first stocker having a plurality of first substrates with a plurality of grades of defects, and a second stocker having a plurality of second substrates to be paired with one of the first substrates, and having a plurality of grades of defects. The second stocker receives the grade of the first substrate and selects the second substrate with a grade corresponding to the grade of the received first substrate. The workpiece is assembled by receiving one of the first substrates and determining the grade of the received first substrate. The grades of the second substrates in a cassette is surveyed and determined if there is a second substrate with the same grade as the received first substrate. One of the second substrates is selected if it is determined that there is a second substrate with a grade corresponding to that of the received first substrate. The selected second substrate is placed in a new cassette.