Abstract: The present invention provides a position control system for a remote-controlled vehicle, a vehicle operated by the control system, and a method for operating a remote-controlled vehicle. An electromagnetic energy receiver is configured to receive an electromagnetic beam. The electromagnetic energy receiver is further configured to determine a position of the remote-controlled vehicle relative to a position of the electromagnetic beam. The vehicle is directed to maneuver to track the position of the electromagnetic beam.

Abstract: In one embodiment, a method for fabricating electromagnetic meta-materials includes applying first and second array of electromagnetically reactive patterns to first and second non-conducting surfaces, wherein the first array includes at least one of a split ring resonator pattern, a square split ring resonator pattern, and a swiss roll pattern, and the second array includes a thin parallel wire pattern. The first and second non-conducting surfaces are joined together such that the first and second non-conducting surfaces bearing the first and second arrays of electromagnetically reactive patterns are commonly oriented. Alternately, a method may further include slicing between elements of the first and second arrays of electromagnetically reactive patterns in a plane perpendicular to the first and second surfaces to form a plurality of slices, rotating at least one of the slices, and applying a third array of electromagnetically reactive patterns to a third non-conducting surface.

Abstract: A method is provided to generate electrical current. The method includes creating a plurality of unitary masses each connected to one of a plurality of piezoceramic mass supports. The mass supports are electrically joined to a sheath. The method also includes removing material from the unitary masses to operably limit a mass vibration deflection. The sheath is attached to a vibrating body. The unitary masses are pre-tuned to match at least one natural frequency mode of the vibrating body. The unitary masses and the piezoceramic mass supports are induced to vibrate to generate the electrical current.

Abstract: The present invention is a solid state thermal engine and method for creating a solid state thermal engine that provides an effective thermal tunneling gap between a hot and cold electrode. The effective gap produced in the present invention is on the order of one nanometer. A via is etched through a first side of first and second substrates, and metal electrodes are attached to a second side of the first and second substrates. The second sides are opposite the first sides. The metal electrodes are mated by bonding the second side of the first substrate to the second side of the second substrate.

Abstract: A method for fabrication of electromagnetic meta-materials and structure fabricated thereby are disclosed. A substrate material is provided, and an array of electromagnetically reactive patterns of a conductive material are formed on a first face of the substrate material. An array of electromagnetically reactive patterns of a conductive material is applied to each respective face of layers of a substrate used to form a block. The substrate block is successively formed by joining each of the respective faces together such that the faces bearing the electromagnetically reactive patterns are commonly oriented. A new set of substrate layers is formed by slicing the block between elements of the array of patterns in a plane perpendicular to a face to which the electromagnetically reactive patterns were applied. After each slice is made, the slices are rotated to present a face to which magnetically conductive patterns have not yet been applied.

Abstract: A piezoelectric device connected to a vibration source converts vibration energy to electrical current. A plurality of pairs of oppositely polarized piezoelectric wafers deflect to produce an electrical current. Each pair of wafers are arranged back-to-back and electrically joined together. The plurality of pairs of wafers are each connected to a set of micro-machined parts. Each pair of wafers form a bimorph, configured as a cantilevered beam attached to a set of parts to form an element. Each cantilevered beam has a mass weighted first end and is fixedly attached to one or more flexible sheaths on a second end. A plurality of elements form a cell unit. A plurality of cell units form an array. The electrical current produced varies by the number of elements per cell unit, and/or with the number of cell units per array.

Abstract: A piezoelectric device connected to a vibration source converts vibration energy to electrical current. A plurality of pairs of oppositely polarized piezoelectric wafers deflect to produce an electrical current. Each pair of wafers are arranged back-to-back and electrically joined together. The plurality of pairs of wafers are each connected to a set of micro-machined parts. Each pair of wafers form a bimorph, configured as a cantilevered beam attached to a set of parts to form an element. Each cantilevered beam has a mass weighted first end and is fixedly attached to one or more flexible sheaths on a second end. A plurality of elements form a cell unit. A plurality of cell units form an array. The electrical current produced varies by the number of elements per cell unit, and/or with the number of cell units per array.

Abstract: A material and method of manufacture of resistors having the following characteristics, as deposited (no annealing required): (a) easily dry etchable; (b) high, low thermal coefficient of resistance (near zero) and (c) high reliability in both long term temperature stability (>1000 hours@+125° C.).

Abstract: A system and method for analyzing physical parameters of flight data at a plurality of discrete locations about a surface of an aircraft includes a multisensor system having an array of belts. Each belt includes a plurality of interconnected belt segments including a substrate having an electrically conductive digital data bus, and at least one module having a first sensor, a second sensor and a digital signal processor, and a coating for protecting the belt segment. The first and second sensors, which are preferably formed as microelectromechanical sensors sharing a common substrate, respectively generate signals representative of a first physical parameter and a second physical parameter. The processor receives and analyzes the first and second signals to generate a third signal. The third signal is transmitted along the electrically-conductive bus to a remotely-located controller.

Abstract: Semiconductor materials optimized for their electrical conductivity and thermal conductivity promise much higher thermoelectric cooling power. The materials can achieve the same cooling or power generation capacity in thermopiles with less electron current compared with present bulk materials. Because less electron current is required to accomplish the same task, total thermopile semiconductor material cross-sectional area normal to thermal and electron flow is greatly reduced and the element length-to-cross-sectional area aspect ratio is increased. The net result is a significant improvement in the figure of merit, ZT, and in the device Coefficient of Performance (COP).

Abstract: Silicon wafers containing conductive feedthroughs of an hourglass shape located around their peripheries that can be incorporated into multichip modules that includes silicon wafer spacers having radial grooves for receiving cooling fluid.

Abstract: A method of fabricating a high-density multilayer copper/polyimide interconnect structure utilizing a blanket tantalum/tantalum oxide layer that electrically connects all of the electroplating seed layers to the edge of the substrate; upon completion of the electroplating process, the excess tantalum/tantalum oxide layer is etched off to produce isolated conductor lines. A multilayer copper/polyimide interconnect structure may be fabricated by repeating this fabrication sequence for each layer.

Abstract: Methods of forming electrically and/or thermally conductive feedthroughs in silicon wafers by etching a patterned silicon wafer, and formation of multichip modules utilizing silicon wafers having feedthroughs, are disclosed.

Abstract: A method for producing a planar surface on which conductive traces can be formed to fabricate a multi-layer integrated circuit. In this method, a substrate (20) serves as a base for the formation of conductive traces including copper conductors (30). These conductors are preferably bonded to an adhesion layer (22) and coated with a corrosion barrier (31). A first polyimide coating (34) is spin coated over the substrate and the copper conductors, leaving an undulating surface. Portions of the first polyimide coating lying above the copper conductors are removed, and the resulting surface is coated with a second polyimide coating (44). The polyimide comprising the first and second coatings is selected for its characteristic ability to partially dissolve a previously applied layer of the material, so that the two layers combine, thereby leveling out an non-planar irregularities existing in the first layer.

Abstract: A zinc-based temporary electrical connection (e.g., a microfuse) useful in electroplating isolated conductor (i.e., copper) structures and copper/polyimide high-density interconnect structures are disclosed. The microfuse includes a zinc conductor layer, and in some embodiments, additional silicon adhesion and silicon protection layers. The microfuse is conductive, and therefore useful in an electroplating process, until it is treated (e.g., heated to about 400.degree. C. for one hour), to convert it into an insulator due to zinc oxidation, and remains in this state.

Abstract: A method of fabricating a high-density multilayer copper/polyimide interconnect structure utilizing a blanket tantalum/tantalum oxide layer that electrically connects all of the electroplating seed layers to the edge of the substrate; upon completion of the electroplating process, the excess tantalum/tantalum oxide layer is etched off to produce isolated conductor lines. A multilayer copper/polyimide interconnect structure may be fabricated by repeating this fabrication sequence for each layer.

Abstract: In a multi-chip module, a structure for selectively connecting two conductors. A switchable connector (36) is disposed between a first and second portion (30,32) of a copper conductor (28). The switchable connector comprises an amorphous silicon layer (58), which extends between two spacer pads (56) that are electrically connected to the first and second portions of the copper conductor. A barrier layer (60) is formed atop the amorphous silicon, physically separating it from a reactive metal layer (62). The reactive metal layer is coated with an antireflective coating (64). Interaction of the reactive metal layer with the amorphous silicon layer is prevented by the barrier layer until the barrier layer is heated above 500.degree. C. A laser beam (66) is focused on opposite edges of the switchable connector, causing the barrier layer and reactive metal layer to diffuse into the amorphous silicon, forming electrically conductive silicides.

Abstract: In a multi-chip module, a structure for selectively connecting two conductors. A switchable connector (36) is disposed between a first and second portion (30,32) of a copper conductor (28). The switchable connector comprises an amorphous silicon layer (58), which extends between two spacer pads (56) that are electrically connected to the first and second portions of the copper conductor. A barrier layer (60) is formed atop the amorphous silicon, physically separating it from a reactive metal layer (62). The reactive metal layer is coated with an antireflective coating (64). Interaction of the reactive metal layer with the amorphous silicon layer is prevented by the barrier layer until the barrier layer is heated above 500.degree. C. A laser beam (66) is focused on opposite edges of the switchable connector, causing the barrier layer and reactive metal layer to diffuse into the amorphous silicon, forming electrically conductive silicides.

Abstract: The subject invention involves the provision of a cermet for providing relatively high resistivity in a relatively small space. The cermet includes a substrate and multiple, ultra-thin, alternating layers of conductive and nonconductive materials on the substrate. Each ultra-thin layer is formed by radio-frequency sputtering to produce layers of discontinuous islands of particles of each of the above materials. The invention also relates to a method of producing such cermets by radio-frequency sputtering.