Abstract: The invention is related to fabrication of transparent materials by means of ultra-short laser pulses. Method to fabricate materials transparent in most part to laser wavelength comprises forming non-centrosymmetric, non-diffracting beam by optical element that contains at least two zones of birefringent structures changing Pancharatnam-Berry Phase according to the rule specific for that particular zone. The distribution of energy, phase and polarization depends on parameters of light approaching said element. Pulse energy is selected to employ main maximum of distribution to form voids elongated in desired direction while side maxima form changes of chemical character between damages from adjacent pulses. Void damages and zones of chemical changes form desired cut line. The workpiece prepared in said manner is placed in chemically aggressive solution, in which zones affected by laser light are dissolved much faster than non-affected ones. This enables achieving cuts with aspect ration up to 1/50.

Abstract: Invention relates to the field of lasers, particularly to laser processing of transparent materials and can be used for cutting, breaking and other kind of processing of transparent materials, such as glass, chemically strengthened glass, sapphire and other crystalline materials, employing ultrashort pulse asymmetric Gauss-Bessel intensity profile laser beam. Gaussian intensity profile ultrashort pulse laser beam is transformed to asymmetric Gauss-Bessel intensity profile laser beam by inserting an optical element in Gaussian or Gauss-Bessel intensity profile laser beam path.

Abstract: A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31).

Abstract: A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31).