Abstract: Disclosed is a pellicle having a mask adhesive layer having appropriate softness, having a small adhesive residue after being peeled off from a mask, and having good handling characteristics; and a pellicle for preventing position deviation of patterns, in particular in double patterning. The pellicle of the present invention includes a pellicle frame, a pellicle membrane disposed on one end surface of the pellicle frame, and a mask adhesive layer disposed on other end surface of the pellicle frame; wherein the mask adhesive layer includes 35 to 170 weight parts of a hardness adjuster (B) containing a polypropylene (b1) and a propylene based elastomer (b2) per 100 weight parts of a styrene resin (A); and in an electron microscopic photograph of the mask adhesive layer, a phase-separated structure of a continuous phase of the styrene resin (A) and a discontinuous phase of the hardness adjuster (B) is observed.

Abstract: Disclosed is a pellicle having a mask adhesive layer having appropriate softness, having a small adhesive residue after being peeled off from a mask, and having good handling characteristics; and a pellicle for preventing position deviation of patterns, in particular in double patterning. The pellicle of the present invention includes a pellicle frame, a pellicle membrane disposed on one end surface of the pellicle frame, and a mask adhesive layer disposed on other end surface of the pellicle frame; wherein the mask adhesive layer includes 35 to 170 weight parts of a hardness adjuster (B) containing a polypropylene (b1) and a propylene based elastomer (b2) per 100 weight parts of a styrene resin (A); and in an electron microscopic photograph of the mask adhesive layer, a phase-separated structure of a continuous phase of the styrene resin (A) and a discontinuous phase of the hardness adjuster (B) is observed.

Abstract: The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 ? to less than 50 ?.

Abstract: The adhesive resin of the invention comprises a polyimide resin obtained by reacting a diamine component containing the compound (1) as an essential component with a tetracarboxylic dianhydride component. The diamine component contains a silicone diamine having a specific structure and/or the tetracarboxylic dianhydride component contains a silicone acid dianhydride having a specific structure. Film adhesives made by using the adhesive resin preferably together with a thermosetting resin, and, if necessary, an inorganic filler are excellent in low-temperature adhesion, resistance to moisture absorption, heat resistance, and workability in adhesive adhering and are favorably usable as semiconductor-mounting materials for adhering semiconductor elements to substrates.

Abstract: The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 ? to less than 50 ?.

Abstract: A heat resistance resin composition having superb low-temperature adhesiveness and a polyimide/metal laminate which is superior in solder heat resistance and hardly generates swelling when forming a Au—Sn bond or Au—Au bond, which are used for lead-free soldering and COF packaging.

Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained. In the formulas (1) and (4), n is an integer of 3 to 7, each R is independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group, the same or different two hetero atoms selected from nitrogen atoms and oxygen atoms bonded to each benzene ring are at the ortho- or meta-positions to each other on at least one benzene ring, and when n is 3, the hetero atoms are at the ortho- or meta-positions to each other on all the benzene rings. In the formula (4), Y is a tetravalent organic group.

Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained.

Abstract: A flexible metal foil laminate sheet wherein a polyimide layer comprises a polyimide laminate having a three-layer structure in which thermoplastic polyimide layers are formed on both the surfaces of a polyimide film; metal foil layers are heated and pressed against both the sides of the polyimide laminate; and the thickness of the thermoplastic polyimide layer is 100% or more of an average roughness at 10 points on the surface of the metal foil which contacts the thermoplastic polyimide layer; and a method for manufacturing the flexible metal foil laminate sheet. According to the present invention, there can be manufactured the flexible metal foil laminate sheet in which a necessary and sufficient adhesive force is present in an interface between a metal foil and an insulating layer and which is excellent in heat resistance, chemical resistance, electrical properties and the like.