Abstract: The present invention relates to alicyclic epoxy compounds obtained by selectively hydrogenating aromatic rings of aromatic epoxy compounds in the presence of a hydrogenation catalyst, the concentration of the platinum group element in the product alicyclic epoxy compound being not more than 2 ppm.

Abstract: The present invention relates to alicyclic epoxy compounds obtained by selectively hydrogenating aromatic rings of aromatic epoxy compounds in the presence of a hydrogenation catalyst, the concentration of the platinum group element in the product alicyclic epoxy compound being not more than 2 ppm.

Abstract: A photoresist composition comprising an alkali-soluble resin (A) and a radiation sensitive compound (B), as main components, which further contains a compound (C) of the following formula (I): ##STR1## wherein each of R.sup.1 to R.sup.4 which are independent of one another, is a hydrophobic substituent or a hydrogen atom, provided that all of R.sup.1 to R.sup.4 are not simultaneously hydrogen atoms, and each of a to d which are independent of one another, is an integer of from 1 to 5, and when any one of R.sup.1 to R.sup.4 is present in a plurality, the plurality of such any one of R.sup.1 to R.sup.4 may be the same or different.

Abstract: A photosensitive resin composition comprising an alkali-soluble resin (A), a compound (B) containing a 1,2-quinonediazide group, and a compound (C) of the following formula (I): ##STR1## wherein each of Ar.sup.1 to Ar.sup.3 which are independent of one another, is an aromatic hydrocarbon group which may be substituted by a halogen atom, a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group, and R is a hydrogen atom, a hydroxyl group, a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group.

Abstract: A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, wherein the photosensitive compound comprises 1 a quinonediazide sulfonate of a novolak resin (A) of the following formula (i) having a weight average molecular weight of from 600 to 2,200 or a novolak resin (B) of the following formula (ii) having a weight average molecular weight of from 600 to 2,200, and 2 a quinonediazide sulfonate of a hydroxybenzophenone (C) of the following formula (iii): ##STR1## wherein each of R.sup.1 and R.sup.4 is an alkyl group, R.sup.2 is an alkyl group or an aryl group, R.sup.3 is a hydrogen atom or an alkyl group, each of u and v is an integer of from 0 to 3, provided that when each of R.sup.1 to R.sup.4 is present in a plurality, the plurality of each of R.sup.1 to R.sup.4 may be the same or different, and each of k and l is a number of at least 0, provided that k:l=1:9 to 10:0; ##STR2## wherein R.sup.

Abstract: A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide type photosensitive compound and a solvent, in which the quinonediazide type photosensitive compound contains a quinonediazide sulfonic acid ester of a polycondensate (d) of at least one phenolic compound (a) of the formula (A) with at least one hydroxy aromatic aldehydes (b) of the formula (B) and at least one carbonyl compounds (c) of the formula (C), and the mixing ratio ((b)/(c) mol ratio) of the hydroxy aromatic aldehydes (b)/the carbonyl compounds (c) is from 1/99 to 99/1, and the polycondensate (d) has a weight average molecular weight of from 600 to 2,000 in terms of polystyrene calculation: ##STR1## (wherein R.sup.1 is an alkyl group having a carbon number of from 1 to 4, an alkoxy group having a carbon number of from 1 to 4 or a hydroxyl group, R.sup.2 is an alkyl group having a carbon number of from 1 to 4 or an alkoxy group having a carbon number of from 1 to 4, R.sup.3 and R.sup.

Abstract: A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound (A) of the following formula (A) with 2 formaldehyde (a) and at least one carbonyl compound (b) of the following formula (B), in which the mixing ratio of the formaldehyde (a) to the carbonyl compound (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b), and the alkaline soluble resin has partial structures of the following formula (C), in which the weight ratio of repeating units (.beta.) wherein m is from 1 to 5, to repeating units (.alpha.) wherein m is 0, i.e. the weight ratio of (.beta.)/(.alpha.), is at most 0.25: ##STR1## wherein R.sup.1 is a group of the formula R.sup.2, OR.sup.3, COOR.sup.4 or CH.sub.2 COOR.sup.5, wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3, R.sup.4 and R.sup.

Abstract: A composition for an anti-reflective coating on resist, which comprises a water-soluble fluorine compound and water as the main components, wherein the water-soluble fluorine compound contains (A) a water-soluble fluorine compound that is solid at 20.degree. C., 1 atmospheric pressure, and (B) a water-soluble fluorine compound that is liquid at 20.degree. C., 1 atmospheric pressure and that has a boiling point of at least 100.degree. C. under 1 atmospheric pressure.

Abstract: A composition for forming anti-reflection film on resist surface which comprises an aqueous solution of a water soluble fluorine compound, and a pattern formation method which comprises the steps of coating a photoresist composition on a substrate; coating the above-mentioned composition for forming anti-reflection film; exposing the coated film to form a specific pattern; and developing the photoresist, are provided. Since the composition for forming anti-reflection film can be coated on the photoresist in the form of an aqueous solution, not only the anti-reflection film can be formed easily, but also, the film can be removed easily by rinsing with water or alkali development. Therefore, by the pattern formation method according to the present invention, it is possible to form a pattern easily with a high dimensional accuracy.

Abstract: A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound of the following formula (A) and 2 (a) formaldehyde and (b) at least one ketone or aldehyde of the following formula (B), and the mixing ratio of the formaldehyde (a) to the ketone or aldehyde (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b): ##STR1## wherein R.sup.1 is a group of the formula R.sup.2,OR.sup.3,COOR.sup.4 or CH.sub.2 COOR.sup.5,wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3,R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 may be the same or different, and each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.

Abstract: A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound of the following formula (A) and 2 (a) formaldehyde and (b) at least one ketone or aldehyde of the following formula (B), and the mixing ratio of the formaldehyde (a) to the ketone or aldehyde (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b): ##STR1## wherein R.sup.1 is a group of the formula R.sup.2, OR.sup.3, COOR.sup.4 or CH.sub.2 COOR.sup.5 wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3, R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 are the same or different, and each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.

Abstract: A photoresist composition useful for the preparation of semiconductors and to be irradiated by light with a wavelength of from 330 to 450 nm, which comprises (1) an alkali-soluble resin, (2) a quinone-diazide type photosensitive compound and (3) a solvent, wherein(a) said quinone-diazide type photosensitive compound is composed mainly of a quinone-diazide sulfonate of a novolac resin produced by polycondensation of at least one phenolic compound of the following formula (A1) or (A2) and at least one ketone or aldehyde derivative of the following formula (B),(b) the weight-average molecular weight (the analytical value calculated as polystyrene by gel permeation chromatography) of said novolac resin is from 400 to 2,000 in the case of the novolac resin derived from the phenolic compound of the formula (A1) and from 600 to 2,200 in the case of the novolac resin derived from the phenolic compound of the formula (A2), and(c) the esterification ratio of said quinone-diazide sulfonate (the number of quinone-diazide

Abstract: A process for producing aromatic carbamates in high yield is described, which comprises reacting aromatic nitro compounds, organic compounds containing a hydroxy group, and carbon monoxide in the presence of a catalyst comprising: (1) a platinum group metal or its compound, (2) metallic vanadium or its compound, (3) metallic iron or its compound, (4) a halogen atom, and (5) a tertiary amine, wherein the amount of each component used and the composition are adjusted within specific ranges.