Abstract: Methods of forming packaged microelectromechanical resonators include forming a first isolation trench in a first surface of a capping substrate, with the first isolation trench encircling a first portion of the capping substrate. The first isolation trench is filled with an electrically insulating material. The first surface of the capping substrate is bonded to a device substrate, which includes the microelectromechanical resonator and at least a first electrically conductive line connected to the microelectromechanical resonator. A second surface of the capping substrate is planarized for a sufficient duration to thereby expose the electrically insulating material and the first portion of the capping substrate encircled by the first isolation trench. The exposed first portion of the capping substrate is selectively etched to thereby define a through-substrate opening therein, which exposes a first portion of the first electrically conductive line.

Abstract: A device and method for fabricating the device is disclosed. The device includes a substrate having an active layer disposed on a sacrificial layer. A trench is formed in the active layer to electrically isolate first and second regions in the active layer, and a non-conductive material is deposited on the substrate such that the non-conductive material fills the trench to form a substantially planar surface for support of further components of the device. In some cases, the non-conductive material fills only a portion of the trench sufficient to form the substantially planar surface. The non-conductive material may include silicon nitride.

Abstract: A method is provided for making a microelectromechanical device with high aspect ratio features. First, an insulating layer is deposited on a substrate. Next, a base in the form of a first conducting layer is deposited on the insulating layer and is patterned. A first sacrificial layer is then deposited on the first conducting layer and patterned. A slider in the form of a second conducting layer is then deposited on the first sacrificial layer and patterned. A second sacrificial layer is then deposited on the second conducting layer and patterned. Next, a retainer in the form of a third conducting layer is deposited on the second sacrificial layer and patterned. A mask is then deposited on the third conducting layer and patterned. Next, a reflector in the form of a fourth layer is deposited through the mask onto the third conducting layer. Finally, the mask, first sacrificial layer and second sacrificial layer are removed.

Abstract: A vibromotor (10) includes a polysilicon surface-micromachined substrate. A movable guided element is slidably mounted on the substrate. At least one thermal actuator (20) has an impact head (40) and an anchoring end. The anchoring end pivotally disposed on the substrate external to a side of the movable guided element controls the movement of the movable guided element by electrothermally biasing the impact head (40) to tap against the movable guided element.