Patents by Inventor Ming-Chang Teng

Ming-Chang Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8040104
    Abstract: A workstation including a workstation body, a horizontal omni-directional moving carrier, a sensor mechanism, a grabbing device, and a control unit is provided. The horizontal omni-directional moving carrier carries the workstation body. The sensor mechanism includes an oscillating bar and a plurality of electrodes. The oscillating bar pivoted on the workstation body leans against an autonomous mobile device when the device enters the workstation. The electrodes, disposed on the oscillating bar, electrically connect the autonomous mobile device when the oscillating bar leans against the autonomous mobile device. The grabbing device is disposed on the workstation body. The control unit is electrically connected to the electrodes and the grabbing device.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: October 18, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Chang Teng, Yi-Zheng Wu, One-Der Long
  • Publication number: 20110139076
    Abstract: An intelligent pet-feeding device is disclosed, which comprises: a frame, configured with at least one opening; a storage tank, for storing at least one kind of food while enabling each kind of food to be transported out of the frame from it corresponding opening; a communication module, capable of performing a wireless communication with an operator at a remote end; an imaging module, for capturing images and thus generating image signals accordingly; an audio transceiver module, for receiving and transmitting audio signals; and a central processing unit, electrically connected to the communication module, the imaging module and the audio transceiver module for processing signals received thereby and generated therefrom.
    Type: Application
    Filed: June 23, 2010
    Publication date: June 16, 2011
    Applicant: Industrial Technology Research Institute
    Inventors: YUEH-JU PU, Ming-Chang Teng, Ching-Yi Kuo, Cheng-Hua Wu
  • Publication number: 20090169347
    Abstract: A workstation including a workstation body, a horizontal omni-directional moving carrier, a sensor mechanism, a grabbing device, and a control unit is provided. The horizontal omni-directional moving carrier carries the workstation body. The sensor mechanism includes an oscillating bar and a plurality of electrodes. The oscillating bar pivoted on the workstation body leans against an autonomous mobile device when the device enters the workstation. The electrodes, disposed on the oscillating bar, electrically connect the autonomous mobile device when the oscillating bar leans against the autonomous mobile device. The grabbing device is disposed on the workstation body. The control unit is electrically connected to the electrodes and the grabbing device.
    Type: Application
    Filed: April 29, 2008
    Publication date: July 2, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Chang Teng, Yi-Zheng Wu, One-Der Long
  • Patent number: 7377769
    Abstract: A discharge apparatus for a two-stage injection molding machine, includes a check shaft seat having a runner, and disposed between a feeding portion and an injection portion of the two-stage injection molding machine, for allowing a plastic material in the feeding portion to enter the injection portion via the runner; at least one check shaft disposed in the check shaft seat, and for opening and closing the runner via movement of the check shaft; at least one cover provided at a side of the check shaft seat, and having at least one discharge hole for discharging residues of the plastic material between the check shaft seat and the check shaft; and at least one adjustable unit for adjusting a discharge speed of the residues of the plastic material. The discharge hole and the adjustable unit can prevent locking of the check shaft and pollution from degraded residues of plastic material.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: May 27, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Chi Chen, Ming-Chang Teng, Wen-Hung Feng
  • Patent number: 7156636
    Abstract: A nozzle contact device of an injection machine has an injection device, a nozzle, a flexible body, a tension buffer device and a tension-measuring device. The nozzle is installed a front side of the injection device. The flexible body is used to drive the injection device to contact or separate from a mold. The tension buffer device is installed at a lateral side of the flexible body, and has an elastic body for receiving tension from the flexible body and decomposing the tension to form a component force and a displacement. The tension-measuring device is used to measure the displacement of the tension buffer device and deciding a contact force between the nozzle and the mold.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: January 2, 2007
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Chang Teng, Cheng-Jien Chen
  • Patent number: 7140860
    Abstract: A two-stage injection molding machine having a pressure sensor device is proposed. The two-stage injection molding machine includes an injection part having an injection cylinder, a driving unit, and an injection rod installed in the injection cylinder; a metering part for feeding plastic material to the injection cylinder of the injection part; and a loadcell installed between the injection rod and the driving unit, wherein pressures in the injection cylinder during the feed metering, injection, and packing processes are detected via the loadcell and the pressure sensor rod. As a result, an accurate pressure feedback control is implemented to achieve high precision injection molding quality. And with the two-stage injection molding machine having such a simple structural design, occurrence of signal distortion and delayed response is prevented.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: November 28, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Chi Chen, Wen-Hung Feng, Ming-Chang Teng
  • Patent number: 7128563
    Abstract: A clamping device for injection molding machine is proposed. The clamping device has a movable mold holder, a guiding unit, a screw rod unit, a transmission unit, a first clamping unit, and a second clamping unit. Power from the driving source is transmitted via the transmission unit to the screw rod unit, so as to drive the movable mold holder to move in reciprocating motion. When the mold is actuated to close, the first clamping unit engages to a gear wheel member of the screw rod unit. The gear wheel member and the first clamping unit are driven by the second clamping unit to move for generating a rotational torque, and to drive the screw rod unit for generating a clamping thrust.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: October 31, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Chang Teng, Hsiang-Nien Chung
  • Publication number: 20060134252
    Abstract: A nozzle contact device of an injection machine has an injection device, a nozzle, a flexible body, a tension buffer device and a tension-measuring device. The nozzle is installed a front side of the injection device. The flexible body is used to drive the injection device to contact or separate from a mold. The tension buffer device is installed at a lateral side of the flexible body, and has an elastic body for receiving tension from the flexible body and decomposing the tension to form a component force and a displacement. The tension-measuring device is used to measure the displacement of the tension buffer device and deciding a contact force between the nozzle and the mold.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 22, 2006
    Inventors: Ming-Chang Teng, Cheng-Jien Chen
  • Publication number: 20060134261
    Abstract: A discharge apparatus for a two-stage injection molding machine, includes a check shaft seat having a runner, and disposed between a feeding portion and an injection portion of the two-stage injection molding machine, for allowing a plastic material in the feeding portion to enter the injection portion via the runner; at least one check shaft disposed in the check shaft seat, and for opening and closing the runner via movement of the check shaft; at least one cover provided at a side of the check shaft seat, and having at least one discharge hole for discharging residues of the plastic material between the check shaft seat and the check shaft; and at least one adjustable unit for adjusting a discharge speed of the residues of the plastic material. The discharge hole and the adjustable unit can prevent locking of the check shaft and pollution from degraded residues of plastic material.
    Type: Application
    Filed: July 26, 2005
    Publication date: June 22, 2006
    Inventors: Ming-Chi Chen, Ming-Chang Teng, Wen-Hung Feng
  • Publication number: 20050142245
    Abstract: A two-stage injection molding machine having a pressure sensor device is proposed. The two-stage injection molding machine includes an injection part having an injection cylinder, a driving unit, and an injection rod installed in the injection cylinder; a metering part for feeding plastic material to the injection cylinder of the injection part; and a loadcell installed between the injection rod and the driving unit, wherein pressures in the injection cylinder during the feed metering, injection, and packing processes are detected via the loadcell and the pressure sensor rod. As a result, an accurate pressure feedback control is implemented to achieve high precision injection molding quality. And with the two-stage injection molding machine having such a simple structural design, occurrence of signal distortion and delayed response is prevented.
    Type: Application
    Filed: March 9, 2004
    Publication date: June 30, 2005
    Inventors: Ming-Chi Chen, Wen-Hung Feng, Ming-Chang Teng
  • Patent number: 6893246
    Abstract: A clamping device for injection-molding machine includes a high-speed screw rod unit having a nut element screwed thereto and a movable mold holder connected to a front end thereof, a clamping screw rod unit screwed to a rear end of the nut element and connected to a transmission assembly, a pre-pressing unit adjustably tightened to the clamping screw rod unit for the latter to generate a pre-pressure against the nut element, and a braking unit adapted to brake the nut element. When the nut element is not braked, the high-speed screw rod unit is driven by the transmission assembly to move forward at high speed for closing mold. And, when the nut element is braked and the clamping screw rod unit is driven by the transmission assembly to rotate relative to the nut element, the nut element is linearly pushed forward to generate a high-pressure clamping force during closing mold.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: May 17, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Chang Teng, Hsiang-Nien Chung, Wen-Hung Feng, Ming-Chi Chen
  • Publication number: 20050042326
    Abstract: A clamping device for injection molding machine is proposed. The clamping device has a movable mold holder, a guiding unit, a screw rod unit, a transmission unit, a first clamping unit, and a second clamping unit. Power from the driving source is transmitted via the transmission unit to the screw rod unit, so as to drive the movable mold holder to move in reciprocating motion. When the mold is actuated to close, the first clamping unit engages to a gear wheel member of the screw rod unit. The gear wheel member and the first clamping unit are driven by the second clamping unit to move for generating a rotational torque, and to drive the screw rod unit for generating a clamping thrust.
    Type: Application
    Filed: October 10, 2003
    Publication date: February 24, 2005
    Inventors: Ming-Chang Teng, Hsiang-Nien Chung
  • Publication number: 20040037917
    Abstract: A clamping device for injection-molding machine includes a high-speed screw rod unit having a nut element screwed thereto and a movable mold holder connected to a front end thereof, a clamping screw rod unit screwed to a rear end of the nut element and connected to a transmission assembly, a pre-pressing unit adjustably tightened to the clamping screw rod unit for the latter to generate a pre-pressure against the nut element, and a braking unit adapted to brake the nut element. When the nut element is not braked, the high-speed screw rod unit is driven by the transmission assembly to move forward at high speed for closing mold. And, when the nut element is braked and the clamping screw rod unit is driven by the transmission assembly to rotate relative to the nut element, the nut element is linearly pushed forward to generate a high-pressure clamping force during closing mold.
    Type: Application
    Filed: December 13, 2002
    Publication date: February 26, 2004
    Inventors: Ming-Chang Teng, Hsiang-Nien Chung, Wen-Hung Feng, Ming-Chi Chen
  • Patent number: 6291336
    Abstract: A method for improving the electrical resistance of contacting surfaces in via holes in semiconductor substrates is disclosed. The via holes are formed and later filled with metal to interconnect metal layers in the substrate. The method involves the deposition of interconnect metal at two different stages of two different temperatures. In another embodiment, after sputter etch cleaning, one layer of specific thickness of interconnect metal is deposited at a specific temperature range.
    Type: Grant
    Filed: June 20, 1997
    Date of Patent: September 18, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventor: Ming-Chang Teng
  • Patent number: 5851912
    Abstract: An method for the fabrication of an ohmic, low resistance contact to heavily doped silicon is described using a CVD deposited tungsten plug provided with Ti/TiN barrier metallurgy. The method provides for surface planarization using a borophosphosilicate glass insulator deposited on the silicon. After the glass is flowed to planarize its surface, contact holes are patterned in the glass and the exposed silicon substrate contacts are implanted. Instead of activating the implant with a rapid-thermal-anneal at this point the Ti/TiN barrier metallurgy is applied first followed by the anneal. This provides support for the glass at the upper corners of the contact opening during the anneal and thus prevents them from deforming and encroaching into the contact hole opening.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: December 22, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jhon-Jhy Liaw, Jin-Yuan Lee, Ming-Chang Teng
  • Patent number: 5736458
    Abstract: A method for improving the electrical resistance of contacting surfaces in via holes in semiconductor substrates is disclosed. The via holes are formed and later filled with metal to interconnect metal layers in the substrate. The method involves the introduction of a post-treatment process in the filling of vias with metal. Specifically, the nitrogen treatment step followed by a vacuum break is introduced right after the deposition of a titanium layer over the exposed first upper metal layer when the via holes are first opened. The treatment is accomplished in situ, that is, without breaking vacuum, and at room temperature. The remaining steps of filling the vias follow the conventional methods. It is shown that the contact resistances are reduced and that a further reduction in the contact resistance is achieved if the nitrogen treatment is performed along with vacuum break.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: April 7, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Ming-Chang Teng
  • Patent number: 5688555
    Abstract: A method and an apparatus are disclosed for preventing the formation of humps along the edge of substrates while being spin coated. Said humps are especially observed in edge rinsing substrates that are being coated with spin-on-glass (SOG) and state of the art photoresists. The edge rinse is usually directed at the edge of the substrate at a certain angle from the vertical axis of the rotating substrate. The hump is a consequence of the phenomenon of hydraulic jump that occurs in fluid flow. The humps, later in the manufacturing process, disintegrate causing particle contamination problems. A novel technique is proposed where the formation of humps is prevented by directing a jet stream of gas at the hump. The jet is placed along the plane of the spinning substrate, and behind the rinse nozzle in the direction of the spin.
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: November 18, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd
    Inventor: Ming-Chang Teng
  • Patent number: 5554565
    Abstract: An improved method for the fabrication of an ohmic, low resistance contact to heavily doped silicon is described using a CVD deposited tungsten plug provided with Ti/TiN barrier metallurgy. The method provides for surface planarizatiion by depositing first a layer of silicon oxide followed by a layer of borophosphosilicate glass onto a silicon wafer containing integrated circuit devices. After the glass is thermally flowed to planarize its surface, it is etched back to a suitable thickness and a second layer of silicon oxide is deposited over the now-planar surface. Contact holes are patterned in the composite silicon oxide-glass-silicon oxide structure and the exposed silicon device contacts are ion-implanted. The implant is then activated by rapid-thermal-annealing. The presence of the second silicon oxide layer prevents the upper corners of the contact openings from flowing and encroaching into the opening as would occur in its absence.
    Type: Grant
    Filed: February 26, 1996
    Date of Patent: September 10, 1996
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Jhon-Jhy Liaw, Jin-Yuan Lee, Ming-Chang Teng