Patents by Inventor Ming-Chieh Yu

Ming-Chieh Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152649
    Abstract: The disclosure provides a data privacy protection method, a server device, and a client device for federated learning. A public dataset is used to perform model training on a machine learning model by a server device to generate a gradient pool including multiple first gradients. The gradient pool and the machine learning model are received by a client device. The client device uses a local dataset to perform model training on the machine learning model to obtain a second gradient. A local gradient is selected from the first gradients in the gradient pool according to the second gradient using a differential privacy algorithm by the client device. An aggregated machine learning model is generated by performing model aggregation based on the local gradient by the server device.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 9, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Chih Kao, Pang-Chieh Wang, Chia Mu Yu, Kang Cheng Chen
  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 7003870
    Abstract: In an apparatus for inserting a handle part into a mold for blow molding a bottle, a pick-up unit includes a vertical backing plate, a clamping unit projecting substantially horizontally from the backing plate for clamping therebetween a portion of the handle part, and an ejector hole formed in the backing plate. A release unit is disposed at one side of the backing plate opposite to the clamping unit, and includes a plunger movable through the ejector hole for pushing the handle part away from the clamping unit.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: February 28, 2006
    Inventor: Ming-Chieh Yu
  • Publication number: 20040130074
    Abstract: A method for blow molding a container having a container body and a handle part includes the steps of: preparing a mold including a bottom mold part having a bottom cavity and a receiving space, and an upper mold part having an upper cavity corresponding to the bottom cavity; placing the handle part into the receiving space; placing a container preform into the bottom cavity; through the upper mold part, closing the bottom mold part so that the upper cavity cooperates with the bottom cavity to define a mold cavity for blow molding the container body; and blow molding the container preform into the container body in a manner to integrate the container body with the handle part to result in the container.
    Type: Application
    Filed: March 18, 2003
    Publication date: July 8, 2004
    Inventor: Ming-Chieh Yu
  • Publication number: 20040083603
    Abstract: In an apparatus for inserting a handle part into a mold for blow molding a bottle, a pick-up unit includes a vertical backing plate, a clamping unit projecting substantially horizontally from the backing plate for clamping therebetween a portion of the handle part, and an ejector hole formed in the backing plate. A release unit is disposed at one side of the backing plate opposite to the clamping unit, and includes a plunger movable through the ejector hole for pushing the handle part away from the clamping unit.
    Type: Application
    Filed: January 10, 2003
    Publication date: May 6, 2004
    Inventor: Ming-Chieh Yu
  • Publication number: 20040074861
    Abstract: A bottle cap includes a cover body adapted to be sleeved on a neck of a bottle, a latch ring portion having a lower peripheral margin with a plurality of integral retaining fins extending upwardly and inwardly therefrom, and a plurality of frangible tabs for interconnecting integrally the cover body and the latch ring portion. The retaining fins have upper ends adapted to be disposed under the flange of the bottle so as to prevent removal of the cap from the neck of the bottle. Each retaining fin has a pair of inclined inner and outer side surfaces, one of which is formed with a plurality of integral reinforcing ribs that are spaced apart from one another along the circumferential direction of the latch ring portion.
    Type: Application
    Filed: January 8, 2003
    Publication date: April 22, 2004
    Inventors: Yu-Chi Chuang, Ming-Chieh Yu