Patents by Inventor Ming-Chien Lin

Ming-Chien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11987431
    Abstract: A top-opening substrate carrier comprises a container body, a door member and at least one latching mechanism. The latching mechanism includes a rotary drive member, a first driven cam, a second driven cam, a first connecting rod, a second connecting rod, two longitudinal latching arms and two lateral latching arms. The first driven cam and the second driven cam are disposed at two sides of the rotary drive member. When the rotary drive member is rotated by force, it links and activates the first connecting rod and the second connecting rod to synchronously drive the first driven cam and the second driven cam to rotate, thereby driving the two longitudinal latching arms and the two lateral latching arms to project towards locking holes of the container body and locked, or retract from the locking holes of the container body and unlocked.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: May 21, 2024
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Cheng-En Chung, Chih-Ming Lin, Po-Ting Lee, Wei-Chien Liu, Tzu-Ning Huang
  • Patent number: 11991824
    Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.
    Type: Grant
    Filed: September 26, 2021
    Date of Patent: May 21, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen, Cheng-Chung Lo
  • Patent number: 11981483
    Abstract: The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: May 14, 2024
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Chia-Ho Chuang, Shu-Hung Lin, Ming-Chien Chiu
  • Patent number: 11948820
    Abstract: The present invention provides a latching guide structure arranged inside a door of semiconductor carrier. The latching guide structure comprises an upper latching part, a lower latching part, at least one elastic unit and a driver. Moreover, a first guiding portion of the upper latching part is matched with a second guiding portion of the lower latching part, therefore to define the installation space for the at least one elastic unit. On the other hand, the driver simultaneously actuates an upper actuating unit of the first guiding portion and a lower actuating unit of the second guiding portion to linearly move in reverse direction therebetween. The range of the linear motion of the upper actuating unit and the lower actuating unit represents the compression or extension of the at least one elastic unit, determining to control the open/close status of the upper latching part and the lower latching part.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: April 2, 2024
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Chih-Ming Lin, Cheng-Han Chou, Po-Ting Lee
  • Publication number: 20240105481
    Abstract: The present invention provides a latching guide structure arranged inside a door of semiconductor carrier. The latching guide structure comprises an upper latching part, a lower latching part, at least one elastic unit and a driver. Moreover, a first guiding portion of the upper latching part is matched with a second guiding portion of the lower latching part, therefore to define the installation space for the at least one elastic unit. On the other hand, the driver simultaneously actuates an upper actuating unit of the first guiding portion and a lower actuating unit of the second guiding portion to linearly move in reverse direction therebetween. The range of the linear motion of the upper actuating unit and the lower actuating unit represents the compression or extension of the at least one elastic unit, determining to control the open/close status of the upper latching part and the lower latching part.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 28, 2024
    Inventors: MING-CHIEN CHIU, CHIH-MING LIN, CHENG-HAN CHOU, PO-TING LEE
  • Patent number: 8648791
    Abstract: A method of determining driving currents of a backlight module includes: disposing the backlight module onto a base; defining a plurality of areas from a top area to a bottom are of the backlight module; and reducing the driving current of the area that is situated further from the base.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: February 11, 2014
    Assignee: AU Optronics Corp.
    Inventors: Su-Yi Lin, Hsin-Wu Lin, Ming-Chien Lin
  • Publication number: 20110157238
    Abstract: A method of determining driving currents of a backlight module includes: disposing the backlight module onto a base; defining a plurality of areas from a top area to a bottom are of the backlight module; and reducing the driving current of the area that is situated further from the base.
    Type: Application
    Filed: March 17, 2010
    Publication date: June 30, 2011
    Inventors: Su-Yi Lin, Hsin-Wu Lin, Ming-Chien Lin
  • Patent number: 7852427
    Abstract: A back bezel assembly for a backlight module is provided. The back bezel comprises a first board and a second board, which are assembled at the edges thereof to form a continuous board. The thermal conductivity of the second board is less than that of the first board. A light source and an inverter are disposed at the opposite sides with respect to the second board, so the second board isolates the heat, generated from the light source device, from being conducted toward the inverter.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: December 14, 2010
    Assignee: AU Optronics Corp.
    Inventor: Ming-Chien Lin
  • Publication number: 20090244430
    Abstract: A back bezel assembly for a backlight module is provided. The back bezel comprises a first board and a second board, which are assembled at the edges thereof to form a continuous board. The thermal conductivity of the second board is less than that of the first board. A light source and an inverter are disposed at the opposite sides with respect to the second board, so the second board isolates the heat, generated from the light source device, from being conducted toward the inverter.
    Type: Application
    Filed: July 22, 2008
    Publication date: October 1, 2009
    Applicant: AU OPTRONICS CORP.
    Inventor: Ming-Chien Lin