Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another. The semiconductor device includes a gate structure that comprises a lower portion and an upper portion, wherein the lower portion wraps around each of the plurality of semiconductor layers. The semiconductor device includes a gate spacer that extends along a sidewall of the upper portion of the gate structure and has a bottom surface. A portion of the bottom surface of the gate spacer and a top surface of a topmost one of the plurality of semiconductor layers form an angle that is less than 90 degrees.

Abstract: The invention discloses a digital signature system. The digital signature system comprises an electronic device and a data storage device. The electronic device generates a specific data by executing a specific operation, and calculates the specific data via a hash algorithm to generate a hash data. The data storage device comprises a controller, a plurality of flash memories, and a data transmission interface. The electronic device transmits the hash data to the data storage device via the transmission interface. The controller comprises a firmware. The firmware reads an unclonable function, and generates a private key according to the unclonable function, and encrypts the hash data by the private key to obtain a digital signature. The data storage device transmits the digital signature to the electronic device via the transmission interface.

Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.

Abstract: Integrated circuit packages and methods of forming the same are provided. In an embodiment, a device includes: a power distribution interposer including: a first bonding layer; a first die connector in the first bonding layer; and a back-side interconnect structure including a power rail connected to the first die connector; and an integrated circuit die including: a second bonding layer directly bonded to the first bonding layer by dielectric-to-dielectric bonds; a second die connector in the second bonding layer, the second die connector directly bonded to the first die connector by metal-to-metal bonds; and a device layer on the second bonding layer, the device layer including a contact and a transistor, the transistor including a first source/drain region, the contact connecting a back-side of the first source/drain region to the second die connector.

Abstract: Disclosed is a drainage bottle system comprising: a system housing, a drainage bottle, a drainage tube, a motorless suction device and a liquid detection device, wherein a piezoelectric suction pump of the motorless suction device generates a negative pressure by means of piezoelectric effect to drive the drainage tube to suck and collect a liquid to be detected into the drainage bottle.

Abstract: A semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. The semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. The semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. The semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. The semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.

Abstract: A signal calibration method, a memory storage device, and a memory control circuit unit are provided. The signal calibration method includes: generating a clock signal and a data strobe signal according to an internal clock signal; respectively transmitting the clock signal and the data strobe signal to a target volatile memory module among multiple volatile memory modules through a first signal path and a second signal path; obtaining a shift value between the data strobe signal and the clock signal at the target volatile memory module; and storing an initial delay setting of the data strobe signal according to delay information of the data strobe signal in response to the shift value being greater than a threshold value.

Abstract: The present disclosure provides a package structure and a method of manufacturing a package. The package structure includes a semiconductor die laterally encapsulated by an encapsulant, a redistribution structure and bumps. The redistribution structure is disposed on the semiconductor die and the encapsulant, and is electrically connected with the at least one semiconductor die. The bumps are disposed on the redistribution structure. The redistribution structure includes dielectric layers and metallic pattern layers sandwiched between the dielectric layers. The redistribution structure includes metallic pads on an outermost dielectric layer of the dielectric layers, and the outmost dielectric layer has undercut cavities beside the metallic pads.

Abstract: The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed directly on an upper surface of the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.

Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.

Abstract: A semiconductor device includes: a first chip including a plurality of first device features and a plurality of first interconnect structures disposed above the first device features; a second chip including a plurality of second device features and a plurality of second interconnect structures disposed above the second device features; and an interposer bonded to the first chip and the second chip, and disposed on an opposite side from the first and second device features with respect to the first and second interconnect structures; wherein the interposer includes a plurality of power rails configured to deliver power to the first and second chips.

Abstract: A lens assembly includes a first lens group, a second lens group, and a third lens group, all of which are arranged in order from an object side to an image side along an optical axis. The first lens group is with positive refractive power and includes at least four lenses, among which the lens closest to the object side includes a convex surface facing the object side, and the lens closest to the image side includes a convex surface facing the image side. The second lens group is with negative refractive power and includes a 2-1 lens and a 2-2 lens, wherein the 2-2 lens includes a convex surface facing the image side. The third lens group is with negative refractive power and includes a 3-1 lens, wherein the 3-1 lens is a meniscus lens with negative refractive power.

Abstract: A lens assembly includes a first lens group, a second lens group, a third lens group, a fourth lens group, a fifth lens group, and a reflective element. The first lens group is with positive refractive power. The second lens group is with negative refractive power. The third lens group is with positive refractive power. The fourth lens group is with negative refractive power. The fifth lens group is with positive refractive power. The reflective element includes a reflective surface. A light from an object side sequentially passes through the first lens group, the second lens group, the third lens group, the fourth lens group, and the fifth lens group to a second side. The reflective element is disposed between a first side and the second side. Intervals of the lens groups are changeable, so that the lens assembly can change the effective focal length.

Abstract: A zoom lens, in sequence from an object side to an image side along an optical axis, comprises a first lens group; a second lens group; a stop; and a rear lens group and comprising a third lens group, a fourth lens group, and a fifth lens group; the fourth lens group further comprises an image correction lens which is able to shifted in a direction transverse to the optical axis of the zoom lens to stabilize the picked-up image when the zoom lens vibrates; furthermore, the zoom lens satisfies the following condition: (1??p)×?r>2, where ?p is a lateral magnification of the image correction lens when the zoom lens is at the telephoto end, and where ?r is a lateral magnification of the lenses in the rear lens group except for the lenses in front of the image correction lens when the zoom lens is at the telephoto end.

Abstract: A zoom lens has a four-group zoom configuration, in order from the object side to the image side, consisting of negative, positive, positive, and positive refractive power. The zoom lens carries out zooming from the wide-angle end to the telephoto end mainly by changing the distance between the third lens group and the fourth lens group. Also, the distance between the second lens group and the third lens group may be decreased in the zooming. Focusing is carried out mainly by moving the second lens group along the optical axis. Such a zoom lens is thin and small in size, and has a great imaging performance.

Abstract: A zoom lens has a four-group zoom configuration, in order from the object side to the image side, consisting of negative, positive, positive, and positive refractive power. The zoom lens carries out zooming from the wide-angle end to the telephoto end mainly by changing the distance between the third lens group and the fourth lens group. Also, the distance between the second lens group and the third lens group may be decreased in the zooming. Focusing is carried out mainly by moving the second lens group along the optical axis. Such a zoom lens is thin and small in size, and has a great imaging performance.

Abstract: A zoom lens, in sequence from an object side to an image side along an optical axis, comprises a first lens group; a second lens group; a stop; and a rear lens group and comprising a third lens group, a fourth lens group, and a fifth lens group; the fourth lens group further comprises an image correction lens which is able to shifted in a direction transverse to the optical axis of the zoom lens to stabilize the picked-up image when the zoom lens vibrates; furthermore, the zoom lens satisfies the following condition: (1??p)×?r>2, where ?p is a lateral magnification of the image correction lens when the zoom lens is at the telephoto end, and where ?r is a lateral magnification of the lenses in the rear lens group except for the lenses in front of the image correction lens when the zoom lens is at the telephoto end.

Abstract: A needle-free connector includes a hollow connector, an elastic block, and a switch assembly. The inner perimeter of the hollow connector forms a first annular wall and a second annular wall. The elastic block is disposed in the hollow connector. The switch assembly has a stop member and a guide tube connected to the stop member, the stop member being pressed between the annular block and the elastic block, the guide tube being disposed in the hollow connector, the external perimeter of the stop member forming a first annular portion against the first annular wall and a second annular portion against the second annular wall, a groove being disposed between the first annular portion and the second annular portion of the stop member, the groove being connected to the guide tube. Thus, the structure stability and closing performance are achieved such that the outside air cannot leak into the connector.

Abstract: An image capture device and a converter lens assembly thereof are provided. The image capture device includes a mobile phone and the converter lens assembly wherein the converter lens assembly is connected to the mobile phone. The converter lens assembly includes a first lens, a second lens, a third lens, a fourth lens and a fifth lens, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens is with positive refractive power. The fourth lens is with positive refractive power. The converter lens assembly satisfies the condition: 1<|f1/f2|<2 and/or the condition: 1<|f345/f2|<2, wherein f1 is the effective focal length of the first lens, f2 is the effective focal length of the second lens, f345 is the effective focal length of the combination of the third lens, the fourth lens and the fifth lens.