Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.

Abstract: A neural network is used to place macros on a chip canvas in an integrated circuit (IC) design. The macros are first clustered into multiple macro clusters. Then the neural network generates a probability distribution over locations on a grid and aspect ratios of a macro cluster. The grid represents the chip canvas and is formed by rows and columns of grid cells. The macro cluster is described by at least an area size, aspect ratios, and wire connections. Action masks are generated for respective ones of the aspect ratios to block out a subset of unoccupied grid cells based on design rules that optimize macro placement. Then, by applying the action masks on the probability distribution, a masked probability distribution is generated. Based on the masked probability distribution, a location on the grid is selected for placing the macro cluster with a chosen aspect ratio.

Abstract: A neural network based method places flexible blocks on a chip canvas in an integrated circuit (IC) design. The neural network receives an input describing geometric features of a flexible block to be placed on the chip canvas. The geometric features includes an area size and multiple aspect ratios. The neural network generates a probability distribution over locations on the chip canvas and the aspect ratios of the flexible block. Based on the probability distribution, a location on the chip canvas is selected for placing the flexible block with a chosen aspect ratio.

Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.

Abstract: A microparticle forming device is used to form microparticles with uniform particle size and proper roundness, and includes a collection pipe, a fluid nozzle, a reactor and a filter. The collection pipe includes a fluid passage, an aqueous-phase fluid inlet, an oil-phase fluid inlet and a mixed fluid outlet, all of which communicate with the fluid passage. The oil-phase fluid inlet is located between the aqueous-phase fluid inlet and the mixed fluid outlet. The fluid nozzle has a plurality of oil-phase fluid drop outlets aligned with the oil-phase fluid inlet of the collection pipe. The reactor has a reaction chamber communicating with the mixed fluid outlet of the collection pipe, a mixing member accommodated in the reaction chamber, and a microparticle collection port communicating communicated with the reaction chamber. Two opposite ends of the filter respectively communicate with the reaction chamber of the reactor.

Abstract: A microparticle forming device is used to form microparticles with uniform particle size and proper roundness, and includes a collection pipe, a fluid nozzle, a reactor and a filter. The collection pipe includes a fluid passage, an aqueous-phase fluid inlet, an oil-phase fluid inlet and a mixed fluid outlet, all of which are communicated with the fluid passage. The oil-phase fluid inlet is located between the aqueous-phase fluid inlet and the mixed fluid outlet. The fluid nozzle has a plurality of oil-phase fluid drop outlets aligned with the oil-phase fluid inlet of the collection pipe. The reactor has a reaction chamber communicated with the mixed fluid outlet of the collection pipe, a mixing member accommodated in the reaction chamber, and a microparticle collection port communicated with the reaction chamber. Two opposite ends of the filter are respectively communicated with the reaction chamber of the reactor.

Abstract: A motherboard of a computer is provided. The motherboard of a computer includes a main body, a notch formed at a side edge of the main body, an auxiliary device, and a fixing device formed adjacent to the notch to fix the auxiliary device in the notch, wherein the auxiliary device is a light guiding device including patterns.

Abstract: A nozzle, an apparatus, and a method for producing dual-layer microparticles used as microcarriers. The nozzle includes a nozzle body having a first fluid passageway and a cover mounted to the nozzle body and having a second fluid passageway. A plurality of extension tubes is communicated with an end of the first fluid passageway and is spaced from each other. Each extension tube includes an outlet port distant to the first fluid passageway. A plurality of sleeves is communicated with the second fluid passageway. Each sleeve includes an opening distant to the second fluid passageway. Each extension tube extends into one of the sleeves. An outer wall of each extension tube is spaced from an inner wall of one of the sleeves. The outlet port of each extension tube is located between the second fluid passageway and the opening of one of the sleeves.

Abstract: A nozzle includes a nozzle body having a fluid passageway to which extension tubes are communicated. Each extension tube includes an end having an outlet port. The outlet ports are spaced from each other. An apparatus includes the nozzle, a fluid tank into which the extension tubes extends, a fluid shear device mounted in the fluid tank, and a temperature control system in which the fluid tank is mounted. A method includes filling a water phase fluid into the fluid tank. An oil phase fluid flows out of the nozzle body via the outlet ports. The water phase fluid is disturbed and flows out of the outlet ports to form semi-products of microparticles in the fluid tank. Each semi-product has an inner layer formed by the oil phase fluid and an outer layer formed by the water phase fluid. The outer layers of the semi-products are removed to form microparticles.

Abstract: A sieve for microparticles includes a seat having a chamber and a plurality of boards mounted in the chamber. Each of the plurality of boards includes a first face and a second face opposite to the first face. The first face includes at least one notch. The second face includes at least one groove. The first face of each of the plurality of boards abuts the second face of an adjacent board. The at least one notch and the at least one groove respectively of two adjacent boards are partially aligned and intercommunicated with each other.

Abstract: A sieve for microparticles includes a seat having a chamber and a plurality of boards mounted in the chamber. Each of the plurality of boards includes a first face and a second face opposite to the first face. The first face includes at least one notch. The second face includes at least one groove. The first face of each of the plurality of boards abuts the second face of an adjacent board. The at least one notch and the at least one groove respectively of two adjacent boards are partially aligned and intercommunicated with each other.

Abstract: A nozzle, an apparatus, and a method are provided for mass production of dual-layer microparticles used as microcarriers. The nozzle includes a nozzle body having a first fluid passageway and a cover mounted to the nozzle body and having a second fluid passageway. A plurality of extension tubes is communicated with an end of the first fluid passageway and is spaced from each other. Each extension tube includes an outlet port distant to the first fluid passageway. A plurality of sleeves is communicated with the second fluid passageway. Each sleeve includes an opening distant to the second fluid passageway. Each extension tube extends into one of the sleeves. An outer wall of each extension tube is spaced from an inner wall of one of the sleeves. The outlet port of each extension tube is located between the second fluid passageway and the opening of one of the sleeves.

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

Abstract: A nozzle includes a nozzle body having a fluid passageway to which extension tubes are communicated. Each extension tube includes an end having an outlet port. The outlet ports are spaced from each other. An apparatus includes the nozzle, a fluid tank into which the extension tubes extends, a fluid shear device mounted in the fluid tank, and a temperature control system in which the fluid tank is mounted. A method includes filling a water phase fluid into the fluid tank. An oil phase fluid flows out of the nozzle body via the outlet ports. The water phase fluid is disturbed and flows out of the outlet ports to form semi-products of microparticles in the fluid tank. Each semi-product has an inner layer formed by the oil phase fluid and an outer layer formed by the water phase fluid. The outer layers of the semi-products are removed to form microparticles.

Abstract: The present invention provides a loading calculation method and a loading calculation system for a processor in an electronic device is disclosed. The loading calculation system comprises: a detecting unit, a determining unit, a generating unit, and a calculating unit. The loading calculation method comprises: detecting a plurality of switching actions of the processor to generate a detecting result; determining a time interval to separate the detecting result to generate a plurality of time periods; generating a log file of scheduling according to the detecting result and the plurality of time periods; utilizing the processor for enabling the log file of scheduling; and calculating the processor loading according to the log file of scheduling.

Abstract: The present invention provides a loading calculation method and a loading calculation system for a processor in an electronic device is disclosed. The loading calculation system comprises: a detecting unit, a determining unit, a generating unit, and a calculating unit. The loading calculation method comprises: detecting a plurality of switching actions of the processor to generate a detecting result; determining a time interval to separate the detecting result to generate a plurality of time periods; generating a log file of scheduling according to the detecting result and the plurality of time periods; utilizing the processor for enabling the log file of scheduling; and calculating the processor loading according to the log file of scheduling.

Abstract: A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.

Abstract: Methods and apparatus for transparently processing files that are manipulated between a server computer and a client computer using the CIFS protocol. The transparent processing employs an in-line CIFS proxy and may include virus scanning, content scanning, and/or security policy implementation.