Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.

Abstract: A method of providing a hybrid distributed fiber optic sensing system (DFOS) that extends an existing fiber optic telecommunications network thereby providing that existing fiber optic telecommunications network with DFOS capabilities.

Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously enable smart refrigeration systems including retail.

Abstract: Aspects of the present disclosure describe distributed fiber optic sensing systems, methods, and structures that advantageously are employed to determine the location and depth of underground fiber-optic facilities that may be carrying telecommunications traffic.

Abstract: A method for forming a packaged integrated circuit device includes providing a semiconductor wafer having a plurality of integrated circuit devices, each integrated circuit device extending into the semiconductor wafer to a first depth, and grinding a backside of the silicon wafer to no more than the first depth. The method further includes forming a backside cut between the integrated circuit devices. The backside cut extends to within the first depth, but the backside cut does not extend completely through the semiconductor wafer. The backside cut exposes a plurality of edges of each of the integrated circuit devices. The method further includes depositing, on the backside of the wafer, a metallization layer on a bottom surface of the integrated circuit devices and on the edges.

Abstract: A method for manufacturing a packaged integrated circuit device includes providing a semiconductor wafer having a plurality of integrated circuit devices. Each integrated circuit device extends into the semiconductor wafer to a first depth. Prior to singulation of the integrated circuit devices on the semiconductor wafer, the method further includes forming a cut between the integrated circuit devices. The cut extends to at least the first depth, but does not extend completely through the semiconductor wafer. The cut exposes a plurality of edges of each of the integrated circuit devices. The method further includes depositing, on each integrated circuit device, a passivation layer on a top surface and on the edges.

Abstract: An electromagnetic field simulation method based on subgridding technique and one-step alternating-direction-implicit-finite-difference time-domain (ADI-FDTD) algorithm is provided herein. The method includes establishing an electromagnetic field simulation model by setting an absorption boundary condition, a periodic boundary condition, a total field boundary condition and a scattering field boundary condition based on the one-step ADI-FDTD algorithm, subgridding technique and FDTD algorithm. The electromagnetic field simulation model is configured to select a detection point and a detection surface, obtain a time-domain waveform diagram of a reflection field of a simulation area, a time-domain waveform diagram of a transmission field of the simulation area and frequency-domain information of the simulation area, and simulate an electromagnetic field, by the electromagnetic field simulation model.

Abstract: An augmented reality processing device is provided, comprising an image capturing circuit and a processor. The processor is connected to the image capturing circuit, and execute operations of: generating an original point cloud image according to the first environment image and a physical object in the first environment image; generating an expanded point cloud image corresponding to the physical object from the second environment image according to the first environment image and the physical object point cloud set, and generating a superimposed point cloud image according to the expanded point cloud image and the original point cloud image; and generating a transformation matrix according to the original point cloud image and the expanded point cloud image, and superimposing a virtual object to the second environment image according to the superimposed point cloud image and the transformation matrix.

Abstract: An electrostatic discharge protection circuit includes an electrostatic discharge clamp between a first rail and a second rail, a trigger device configured to activate the electrostatic discharge clamp in response to an electrostatic discharge event, and a charge dissipation element between the first rail and the second rail to dissipate a residual charge at an input of the trigger device.

Abstract: A fiber optic sensing cable located along a side of a paved road and runs parallel to a driving direction is monitored by distributed fiber optic sensing (DFOS) using Rayleigh backscattering generated along the length of the optical sensor fiber cable under dynamic vehicle loads. The interaction of vehicles with roadway locations exhibiting distressed pavement generates unique patterns of localized signals that are identified/distinguished from signals resulting from vehicles operating on roadway exhibiting a smooth pavement surface. Machine learning methods are employed to estimate an overall road surface quality as well as localizing pavement damage. Power spectral density estimation, principal component analysis, support vector machine (SVM) combined with principal component analysis (PCA), local binary pattern (LBP), and convolutional neural network (CNN) are applied to develop the machine learning models.

Abstract: Disclosed are distributed fiber optic sensing arrangements that—in sharp contrast to the prior art—utilize C-OTDR capabilities to detect an optical fiber end point while still maintaining operational DFOS vibration/acoustic signal sensing functions. Advantageously, such operations are performed automatically without requiring a manual confirmation. A change is made in digital signal processing in the C-OTDR operation by bypassing a high-pass-filtering stage when calculating intensity changes such that the DC signal component is preserved and used to differentiate from a “no-fiber” section. It then calculates the no-fiber section's signal level and uses a back-tracking operation to determine the fiber end automatically.

Abstract: Systems, methods, and structures for efficiently identifying individual fibers located in a deployed cable that advantageously reduces laborious field efforts while reducing service outage time. The systems and methods locate a targeted fiber in a cable (“Cable ID”) and then identify the targeted fiber (“Fiber ID”) by detecting DFOS signal attentions—without cutting the optical fiber. Two distinct determinations may be made namely, Cable ID and Fiber ID. DFOS operation detects vibration signals occurring along a sensor fiber. As implemented, Cable ID is an interactive-machine learning-based algorithm that automatically locates cable position along a sensor fiber route. Fiber ID detects a signal attenuation by bending a group of fibers with bifurcation to pinpoint a targeted individual fiber within a fiber cable.

Abstract: Disclosed are buried cable protection systems and methods that employ impulse signal detection by optical fiber sensing technologies, and which provide such protection automatically and in real-time. The methods theoretically model a time difference of arrival (TDoA) of an impulse wave travelling to a DFOS sensor fiber cable. A model employing a set of propagation relationships that account for vague knowledge about wave propagation speed and threat range(s) is fitted with parameters based on a numerical simulation—without specific knowledge of a source of vibration. As compared to vibration magnitude information, time of arrival (ToA) information is more consistent and less sensitive to ambiguities and inaccuracies. In addition, the model parameter can be adjusted adaptively when temporal resolution of the sensor changes or fluctuates.

Abstract: Aspects of the present disclosure describe systems, methods and structures providing detection and localization of disaster-related indoor events via hybrid ethernet/optical fiber cable.

Abstract: An augmented reality processing device is provided, comprising an image capturing circuit and a processor. The processor is connected to the image capturing circuit, and execute operations of: generating an original point cloud image according to the first environment image and a physical object in the first environment image; generating an expanded point cloud image corresponding to the physical object from the second environment image according to the first environment image and the physical object point cloud set, and generating a superimposed point cloud image according to the expanded point cloud image and the original point cloud image; and generating a transformation matrix according to the original point cloud image and the expanded point cloud image, and superimposing a virtual object to the second environment image according to the superimposed point cloud image and the transformation matrix.

Abstract: A method for underground cable localization by fast time series template matching and distributed fiber optic sensing (DFOS) includes: providing the DFOS system including a length of optical sensor fiber; a DFOS interrogator in optical communication with the optical sensor fiber, said DFOS interrogator configured to generate optical pulses, introduce the generated pulses into the length of optical sensor fiber, and receive backscattered signals from the length of the optical sensor fiber; and an intelligent analyzer configured to analyze DFOS data received by the DFOS interrogator and determine from the backscattered signals, vibrational activity occurring at locations along the length of the optical sensor fiber; deploying a programmable vibration generator to a field location proximate to the length of optical sensor fiber; transmitting to the programmable vibration generator a unique vibration pattern to be generated by the vibration generator; and operating the programmable vibration generator to generate

Abstract: Aspects of the present disclosure describe monitoring of optical fiber by distributed temperature sensing (DTS) and determining optical fiber degradation and/or abnormal environmental events including landslides, fires, etc., from DTS data.

Abstract: A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.

Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously sense/monitor outdoor facilities and structures including outdoor cabinets containing fiber optic facilities in which the cabinet/fiber optic cable contained therein are configured to provide superior acoustic sensing. Further outdoor facilities and structures that are monitored include manhole structures. Superior DFOS/DAS monitoring results are obtained by employing a machine learning-based analysis method that employs a temporal relation network (TRN).

Abstract: This document discloses system, method, and computer program product embodiments for detecting an object. For example, the method includes generating a plurality of cuboids by performing the following operations: defining a plurality of first cuboids each encompassing lidar data points that are plotted on a respective 3D graph of a plurality of 3D graphs; accumulating the lidar data points encompassed by the plurality of first cuboids; computing an extent using the accumulated lidar data points; and defining a second cuboid that has dimensions specified by the extent. The first cuboids and/or the second cuboid may be used to detect the object.