Patents by Inventor Ming-Fu Chang

Ming-Fu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170381
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Chun-Hsien HUANG, Peng-Fu HSU, Yu-Syuan CAI, Min-Hsiu HUNG, Chen-Yuan KAO, Ken-Yu CHANG, Chun-I TSAI, Chia-Han LAI, Chih-Wei CHANG, Ming-Hsing TSAI
  • Publication number: 20240161844
    Abstract: An antifuse-type non-volatile memory and a control method for the antifuse-type non-volatile memory are provided. During a program action of a program cycle, a timing controller generates a timing control signal. According to the timing control signal, a word line driver is controlled to provide an on voltage and an off voltage to an activated word line. In a total time period of plural on periods, the program current is sufficient to rupture a gate oxide layer of an antifuse transistor in the selected memory cell, and a heating process is completed. Consequently, the gate oxide layer of the antifuse transistor is in a solid rupture state. Consequently, the program action can be successfully performed on the selected memory cell.
    Type: Application
    Filed: September 20, 2023
    Publication date: May 16, 2024
    Inventors: Chia-Fu CHANG, Jen-Yu PENG, Ming-Hsuan TAN
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 7691390
    Abstract: The present invention is directed to an isolated polypeptide containing SEQ ID NO: 1 or an immunogenic fragment thereof. Also disclosed is an isolated nucleic acid encoding the polypeptide or containing a sequence at least 70% identical to SEQ ID NO: 3. Within the scope of this invention are related expression vectors, host cells, and antibodies. Also disclosed are methods of producing the polypeptide, diagnosing coronavirus infection, and identifying a test compound for treating coronavirus infection.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: April 6, 2010
    Inventors: Fang-Jen Lee, Chia-Jung Yu, Ming-Fu Chang, Hong-Nerng Ho
  • Publication number: 20090068636
    Abstract: The present invention is directed to an isolated polypeptide containing SEQ ID NO: 1 or an immunogenic fragment thereof. Also disclosed is an isolated nucleic acid encoding the polypeptide or containing a sequence at least 70% identical to SEQ ID NO: 3. Within the scope of this invention are related expression vectors, host cells, and antibodies. Also disclosed are methods of producing the polypeptide, diagnosing coronavirus infection, and identifying a test compound for treating coronavirus infection.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 12, 2009
    Inventors: Fang-Jen Lee, Chia-Jung Yu, Ming-Fu Chang, Hong-Nerng Ho