Patents by Inventor Ming-Hane Lin

Ming-Hane Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging assembly with consolidated common voltage connections for integrated circuits
    Patent number: 5581122
    Abstract: An IC dice mounted on a substrate carrier wherein the IC dice is connected by a plurality of bonding wires to a plurality of corresponding bonding pads on the substrate carrier. The wire bonding layout configuration of the electronic device is improved in the present invention by providing centralized consolidated common voltage pads or bars such that the electric wires connecting the bonding pads to external interface contact points, e.g., the ball grid array (BGA) may be shortened. Additionally, the access widow for wire bonding to the IC dice may be broadened.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: December 3, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Chi Chao, Ming-Hane Lin, Ted C. Ho