Patents by Inventor Ming-hao Chen

Ming-hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163075
    Abstract: The present disclosure provides a privacy computing method based on homomorphic encryption, which includes steps as follows. The ciphertext data is received, where the ciphertext data has a floating-point homomorphic encryption data structure, and the floating-point homomorphic encryption data structure of the ciphertext data includes the ciphertext mantissa, exponent parameter and gain parameter. The gain parameter sets the precision of the floating point corresponding to the ciphertext mantissa. The exponent parameter is adapted to multiplication or division. The artificial intelligence model performs operations on the ciphertext data to return the ciphertext result.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 16, 2024
    Inventors: Yu Te KU, Chih-Fan HSU, Wei-Chao CHEN, Feng-Hao LIU, Ming-Ching CHANG
  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20240120338
    Abstract: A semiconductor device structure is provided. The semiconductor device has a first dielectric wall between an n-type source/drain region and a p-type source/drain region to physically and electrically isolate the n-type source/drain region and the p-type source/drain region from each other. A second dielectric wall is formed between a first channel region connected to the n-type source/drain region and a second channel region connected to the p-type source/drain region. A contact is formed to physically and electrically connect the n-type source/drain region with the p-type source/drain region, wherein the contact extends over the first dielectric wall. The first electric wall has a gradually decreasing width W5 towards a tip of the dielectric wall from a top contact position between the first dielectric wall and either the n-type source/drain region or the p-type source/drain region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Inventors: Ta-Chun LIN, Ming-Che CHEN, Yu-Hsuan LU, Chih-Hao CHANG
  • Patent number: 11953052
    Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 9, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Jian-Hua Chen, Po-Tsung Shih, Yu-Wei Lin, Ming-Hua Ho, Chih-Hao Wu
  • Publication number: 20240111139
    Abstract: An imaging lens assembly module includes a lens barrel, a catadioptric lens assembly, an imaging lens assembly, a first fixing element and a second fixing element. The lens barrel has a first relying surface and a second relying surface, which face towards an object side of the imaging lens assembly module. The catadioptric lens assembly relies on the first relying surface. The imaging lens assembly is disposed on an image side of the catadioptric lens assembly, and relies on the second relying surface. The first fixing element is for fixing the catadioptric lens assembly to the lens barrel. The second fixing element is for fixing the imaging lens assembly to the lens barrel. The catadioptric lens assembly is for processing at least twice internal reflections of an image light in the imaging lens assembly module, and for providing optical refractive power.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 4, 2024
    Inventors: Lin-An CHANG, Chung Hao CHEN, Wen-Yu TSAI, Ming-Ta CHOU
  • Publication number: 20240096827
    Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Inventors: Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng
  • Publication number: 20240080180
    Abstract: The federated learning system includes a moderator and client devices. Each client device performs a method for verifying model update as follows: receiving a hash function and a general model; training a client model according to the general model and raw data; calculating a difference as an update parameter between the general model and the client model, sending the update parameter to the moderator; inputting the update parameter to the hash function to generate a hash value; sending the hash value to other client devices, and receiving other hash values; summing all the hash values to generate a trust value; receiving an aggregation parameter calculated according to the update parameters; inputting the aggregation parameter to the hash function to generate a to-be-verified value; and updating the client model according to the aggregation parameter when the to-be-verified value equals the trust value.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 7, 2024
    Inventors: Chih-Fan HSU, Wei-Chao CHEN, Jing-Lun Huang, Ming-Ching Chang, Feng-Hao Liu
  • Patent number: 11923392
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Jen-Cheng Liu, Kazuaki Hashimoto, Ming-En Chen, Shyh-Fann Ting, Shuang-Ji Tsai, Wei-Chieh Chiang
  • Publication number: 20240072021
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Patent number: 11916084
    Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: February 27, 2024
    Assignee: AUO Corporation
    Inventors: Chun-Yu Lin, Kun-Cheng Tien, Jia-Long Wu, Ming-Lung Chen, Shu-Hao Huang
  • Publication number: 20200363253
    Abstract: A quantitative material supply mechanism: an accommodation bucket, a delivery device, an adjustment device, and a quantitative feeding bucket. The accommodation bucket includes an outlet defined on a bottom thereof. The delivery device includes a conveyor belt, a drive roller, a driven roller, and a driving unit. The driving unit is connected with the drive roller and drives the drive roller to rotate, and the drive roller matches with the driven roller to actuate the conveyor belt to rotate. The adjustment device is arranged above the conveyor belt and is located between the accommodation bucket and the turnaround portion. The adjustment device includes two adjusters and two actuation units opposite to the two adjusters respectively. The quantitative feeding bucket is mounted below the turnaround portion of the conveyor belt so as to hold the materials which are delivered by the conveyor belt and drop from the turnaround portion.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 19, 2020
    Inventors: Ming-Hao Chen, Chia-Ming Chen
  • Publication number: 20100042949
    Abstract: A computer-based menu management system and method creates a record for each of the menu options in a main menu of an electronic device, creates a sub-record for each of sub-menu options in a low hierarchy of each of the menu options, and assigns initial values to parameters of each record and each sub-record. The system and method further adds a predetermined value to each of the parameters of each record or each sub-record, in response to each visit to a corresponding menu option or a corresponding sub-menu option. In addition, the system and method totals current values of the parameters, and sorts the menu options and sub-menu options of each of the menu options according to the current values of the parameters of each record and each sub-record in a predetermined sorting period.
    Type: Application
    Filed: April 27, 2009
    Publication date: February 18, 2010
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: MING-HAO CHEN
  • Patent number: 7300288
    Abstract: The present invention discloses an electrical connector, comprising an insulating body disposed with a plurality of receiving holes, each of which is disposed with a first terminal and a second terminal inter-penetrating each other, wherein the second terminal is a flat shape and the first and second terminals are inclinedly arranged in the terminal receiving hole; and an elastic body disposed between the first and second terminals. The second terminal of the electrical connector is a flat shape so that it may be manufactured by stamping, which is a simple manufacturing process; the first and second terminals are inclinedly arranged in the terminal receiving hole of the insulating body, which can enhance the arrangement density.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: November 27, 2007
    Assignee: Lotes Co., Ltd.
    Inventor: Ming-hao Chen
  • Patent number: D629206
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: December 21, 2010
    Inventor: Ming-Hao Chen
  • Patent number: D1023935
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Ya-Hao Chan, Yi-Heng Lee, Ming-Cheng Wu, Chun-Yu Chen
  • Patent number: D1026897
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: May 14, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ming-Chen Chen, Tong-Shen Hsiung, Chia-Hao Hung