Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: The present invention discloses a kind of hardfacing alloy, which can be applied onto a workpiece's surface by any one surface treatment process in accordance with material, dimensions, and required properties of the workpiece. For example, this novel hardfacing material can be heated to a fully melted state or a partially melted state by using different types of heat sources, such that the melted hardfacing material can be coated onto the surface of any one workpiece to form a protective layer or a surface modification layer. As a result, the workpiece having the surface coating layer with superior characteristics exhibits outstanding functional performances and has a long service time.