Patents by Inventor Ming Hua Shih

Ming Hua Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153881
    Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Inventors: Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
  • Patent number: 11953052
    Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 9, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Jian-Hua Chen, Po-Tsung Shih, Yu-Wei Lin, Ming-Hua Ho, Chih-Hao Wu
  • Publication number: 20140060316
    Abstract: The present invention relates to a vibration energy harvest device. In the present invention, the vibration energy harvest device is provided for being used to recycle the mechanical energy and thermal energy generated during the vibration, and effectively to improve the power generation efficiency with newly added hydraulic motor and electricity generating unit. Wherein by using an ameliorating valve module and removing the damping hole in the prior art, no matter the damping oil flows from inner cylinder module through hydraulic motor to outer cylinder module or the contrary direction, the flowing damping oil could avoid the hydraulic motor from reciprocating to improve the power generation efficiency.
    Type: Application
    Filed: August 13, 2013
    Publication date: March 6, 2014
    Inventors: Chuen-An Chen, Che-Pin Chen, Yao-Ming Huang, Chieh Tung, Ming-Hua Shih, Te-Ming Yeh
  • Patent number: 6571488
    Abstract: Embodiments of the present invention relate to an apparatus for spin drying substrates in a spin dryer tank. A spin dryer cover is movable between a closed position to close an opening of the spin dryer tank and an open position to open the spin dryer tank, and a cylinder is coupled with the spin dryer cover. The cylinder is movable in a first operation to move the spin dryer cover to the open position and movable in a second operation to move the spin dryer cover to the closed position. A system for sensing the position of the spin dryer cover comprises a cylinder sensor configured to sense the first operation and the second operation of the cylinder. A cover sensor is configured to sense the position of the spin dryer cover. A logic circuit is configured to output a cover opening signal indicating that the spin dryer cover is in the open position when the cylinder sensor senses the first operation of the cylinder and the cover sensor senses that the spin dryer cover is in the open position.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: June 3, 2003
    Assignee: Mosel Vitelic, Inc.
    Inventors: Yu Chih Lin, Chih Hsin Tsai, Ming Hua Shih, Shih Kai Pao
  • Publication number: 20020166255
    Abstract: Embodiments of the present invention relate to an apparatus for spin drying substrates in a spin dryer tank. A spin dryer cover is movable between a closed position to close an opening of the spin dryer tank and an open position to open the spin dryer tank, and a cylinder is coupled with the spin dryer cover. The cylinder is movable in a first operation to move the spin dryer cover to the open position and movable in a second operation to move the spin dryer cover to the closed position. A system for sensing the position of the spin dryer cover comprises a cylinder sensor configured to sense the first operation and the second operation of the cylinder. A cover sensor is configured to sense the position of the spin dryer cover. A logic circuit is configured to output a cover opening signal indicating that the spin dryer cover is in the open position when the cylinder sensor senses the first operation of the cylinder and the cover sensor senses that the spin dryer cover is in the open position.
    Type: Application
    Filed: March 1, 2002
    Publication date: November 14, 2002
    Applicant: MOSEL VITELIC, INC., A Taiwanese Corporation
    Inventors: Yu Chih Lin, Chih Hsin Tsai, Ming Hua Shih, Shih Kai Pao