Patents by Inventor Ming-Hua Yeh
Ming-Hua Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11997842Abstract: A fan-out package includes a redistribution structure having redistribution-side bonding structures, a plurality of semiconductor dies including a respective set of die-side bonding structures that is attached to a respective subset of the redistribution-side bonding structures through a respective set of solder material portions, and an underfill material portion laterally surrounding the redistribution-side bonding structures and the die-side bonding structures of the plurality of semiconductor dies. A subset of the redistribution-side bonding structures is not bonded to any of the die-side bonding structures of the plurality of semiconductor dies and is laterally surrounded by the underfill material portion, and is used to provide uniform distribution of the underfill material during formation of the underfill material portion.Type: GrantFiled: August 31, 2021Date of Patent: May 28, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Ming-Chih Yew, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng
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Publication number: 20240153881Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.Type: ApplicationFiled: January 2, 2024Publication date: May 9, 2024Inventors: Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
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Patent number: 11969448Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.Type: GrantFiled: May 12, 2021Date of Patent: April 30, 2024Assignee: GENMONT BIOTECH INC.Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
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Patent number: 11967553Abstract: The present disclosure provides a semiconductor package, including a first semiconductor structure, including an active region in a first substrate portion, wherein the active region includes at least one of a transistor, a diode, and a photodiode, a first bonding metallization over the first semiconductor structure, a first bonding dielectric over the first semiconductor structure, surrounding and directly contacting the first bonding metallization, a second semiconductor structure over a first portion of the first semiconductor structure, wherein the second semiconductor structure includes a conductive through silicon via, a second bonding dielectric at a back surface of the second semiconductor structure, a second bonding metallization surrounded by the second bonding dielectric and directly contacting the second bonding dielectric, and a conductive through via over a second portion of the first semiconductor structure different from the first portion.Type: GrantFiled: March 18, 2022Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ming-Fa Chen, Sung-Feng Yeh, Chen-Hua Yu
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Patent number: 11961800Abstract: A method for forming a via in a semiconductor device and a semiconductor device including the via are disclosed. In an embodiment, the method may include bonding a first terminal and a second terminal of a first substrate to a third terminal and a fourth terminal of a second substrate; separating the first substrate to form a first component device and a second component device; forming a gap fill material over the first component device, the second component device, and the second substrate; forming a conductive via extending from a top surface of the gap fill material to a fifth terminal of the second substrate; and forming a top terminal over a top surface of the first component device, the top terminal connecting the first component device to the fifth terminal of the second substrate through the conductive via.Type: GrantFiled: July 21, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming Shih Yeh
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Publication number: 20240088095Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.Type: ApplicationFiled: November 24, 2023Publication date: March 14, 2024Inventors: Chin-Hua WANG, Shin-Puu JENG, Po-Yao LIN, Po-Chen LAI, Shu-Shen YEH, Ming-Chih YEW, Yu-Sheng LIN
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Publication number: 20240088279Abstract: A method for forming a semiconductor structure includes the steps of forming a stacked structure on a substrate, forming an insulating layer on the stacked structure, forming a passivation layer on the insulating layer, performing an etching process to form an opening through the passivation layer and the insulating layer to expose a portion of the stacked structure and an extending portion of the insulating layer, and forming a contact structure filling the opening and directly contacting the stacked structure, wherein the extending portion of the insulating layer is adjacent to a surface of the stacked structure directly contacting the contact structure.Type: ApplicationFiled: November 27, 2023Publication date: March 14, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Ming-Hua Chang, Po-Wen Su, Chih-Tung Yeh
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Publication number: 20200057325Abstract: A liquid crystal display (LCD) panel adapted to alleviate the separation issue between the pixel array substrate and the opposite substrate is provided. The LCD panel includes a pixel array substrate, a first sealant pattern, a liquid crystal layer, a second sealant pattern and an opposite substrate. The pixel array substrate has an active region and a peripheral region surrounding the active region. The first sealant pattern surrounds the active region. The liquid crystal layer is located on the active region and is located inside the first sealant pattern. The second sealant pattern is located outside the first sealant pattern, and the second sealant pattern includes at least one two-dimensional extending structure. The at least one two-dimensional extending structure is located outside a sidewall corresponding to the first sealant pattern, and includes a plurality of turning structures. The opposite substrate faces the pixel array substrate.Type: ApplicationFiled: October 18, 2018Publication date: February 20, 2020Applicant: Chunghwa Picture Tubes, LTD.Inventors: Yu-Fang Wang, Wen-Cheng Lu, Ming-Hua Yeh
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Patent number: 10261643Abstract: The present invention discloses a novel and inventive transparent conductive film Differing from conventional metal mesh substrates are mainly constituted by silver nanowires (AgNW), the present invention particularly designs a nano metal wire consisting of a metallic core wire, a transition layer and a protection layer, and further develops a transparent conductive film consisting of a substrate and a metal mesh layer; wherein the metal mesh layer is constituted by the said nano metal wires. It is worth describing that, a variety of experimental data prove that the thermal resistance of this novel transparent conductive film is up to 400° C.; moreover, experimental data also exhibit that the transparent conductive film can filter part of blue light portion out of a white light by 20-30%.Type: GrantFiled: January 10, 2017Date of Patent: April 16, 2019Assignee: National Tsing Hua UniversityInventors: Hsueh-Shih Chen, Ming-Hua Yeh, Shih-Jung Ho
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Publication number: 20180067579Abstract: The present invention discloses a novel and inventive transparent conductive film Differing from conventional metal mesh substrates are mainly constituted by silver nanowires (AgNW), the present invention particularly designs a nano metal wire consisting of a metallic core wire, a transition layer and a protection layer, and further develops a transparent conductive film consisting of a substrate and a metal mesh layer; wherein the metal mesh layer is constituted by the said nano metal wires. It is worth describing that, a variety of experimental data prove that the thermal resistance of this novel transparent conductive film is up to 400° C.; moreover, experimental data also exhibit that the transparent conductive film can filter part of blue light portion out of a white light by 20-30%.Type: ApplicationFiled: January 10, 2017Publication date: March 8, 2018Inventors: HSUEH-SHIH CHEN, MING-HUA YEH, SHIH-JUNG HO
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Patent number: 9612241Abstract: The present disclosure provides an optical readout imaging system may include first electrode, a thin film disposed on the first electrode, a biomolecule transfer layer disposed on the thin film, and a second electrode disposed on the biomolecule transfer layer. The present disclosure also provides a biochemical detection method using the optical readout imaging system.Type: GrantFiled: December 19, 2014Date of Patent: April 4, 2017Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, CHANG GUNG MEMORIAL HOSPITAL, LINKOUInventors: Pai-chien Chou, Bo-Wen Xiao, Ming-Hua Yeh, Sin-Huei Wu
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Patent number: 9607960Abstract: A bonding structure comprising a contact pad, an anisotropic conductive film (ACF) and a contact structure is provided. The contact pad includes at least one recess, wherein a thickness of the contact pad is T, and a width of the at least one recess is B, The ACF is disposed on the contact pad and includes a plurality of conductive particles; each of the conductive particles is disposed in the at least one recess. A diameter of the conductive particles is A, and A is larger than B and T and satisfies B?2(AT?T2)1/2. The contact structure is disposed on the ACF and electrically connected to the contact pad via the conductive particles. The disclosure also provides a flexible device including a substrate, a patterned insulating layer, at least one contact pad, ACF, and a contact structure.Type: GrantFiled: December 29, 2015Date of Patent: March 28, 2017Assignee: Industrial Technology Research InstituteInventors: Yi-Cheng Peng, Ming-Hua Yeh
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Publication number: 20160369975Abstract: A quantum dot-containing wavelength converter includes a matrix layer and quantum dots dispersed in the matrix layer. Each of the quantum clots includes a core of a compound M1A1, an inner shell, and a multi-pod-structured outer shell of a compound M1A2 or M2A2. Each of M1 and M2 is a metal selected from Zn, Sn, Pb, Cd, In, Ga, Ge, Mn, Co, Fe, Al, Mg, Ca, Sr, Ba, Ni, Ag, Ti and Cu, and each of A1 and A2 is an element selected from Se, S, Te, P, As, N, I, and O. The inner shell contains a compound M1xM21-xAlyA21-y, wherein M2 is different from M1 and A2 is different from A1. The multi-pod-structured outer shell has a base portion and protrusion portions that extend from the base portion in a direction away from the inner shell.Type: ApplicationFiled: June 22, 2015Publication date: December 22, 2016Applicant: National Tsing Hua UniversityInventors: Hsueh-Shih CHEN, Shih-Jung HO, Guan-Hong CHEN, Ming-Hua YEH
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Publication number: 20150276733Abstract: The present disclosure provides an optical readout imaging system may include first electrode, a thin film disposed on the first electrode, a biomolecule transfer layer disposed on the thin film, and a second electrode disposed on the biomolecule transfer layer. The present disclosure also provides a biochemical detection method using the optical readout imaging system.Type: ApplicationFiled: December 19, 2014Publication date: October 1, 2015Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, CHANG GUNG MEMORIAL HOSPITAL, LINKOUInventors: Pai-chien CHOU, Bo-Wen XIAO, Ming-Hua YEH, Sin-Huei WU
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Patent number: 8791537Abstract: Disclosed is a flexible radiation detector including a substrate, a switching device on the substrate, an energy conversion layer on the switching device, a top electrode layer on the energy conversion layer, a first phosphor layer on the top electrode layer, and a second phosphor layer under the substrate.Type: GrantFiled: April 26, 2012Date of Patent: July 29, 2014Assignee: Industrial Technology Research InstituteInventors: Issac Wing-Tak Chan, Chao-Chiun Liang, Heng-Yin Chen, Ming-Hua Yeh
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Publication number: 20130161772Abstract: Disclosed is a flexible radiation detector including a substrate, a switching device on the substrate, an energy conversion layer on the switching device, a top electrode layer on the energy conversion layer, a first phosphor layer on the top electrode layer, and a second phosphor layer under the substrate.Type: ApplicationFiled: April 26, 2012Publication date: June 27, 2013Applicant: Industrial Technology Research InstituteInventors: Issac Wing-Tak Chan, Chao-Chiun Liang, Heng-Yin Chen, Ming-Hua Yeh
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Publication number: 20130100011Abstract: A human-machine interface device suitable for being electrically connected to an electronic device. The human-machine interface device includes a flexible carrier having at least one flexible portion, a bending sensor, and a control module. The bending sensor is disposed on the flexible portion of the flexible carrier. The control module is disposed on the carrier, connected to the bending sensor, and electrically connected to the electronic device. A first operation signal from the bending sensor is transmitted to the electronic device through the control module so that the electronic device performs according to the first operation signal.Type: ApplicationFiled: March 8, 2012Publication date: April 25, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Chung Lee, Chao-Chiun Liang, Ming-Hua Yeh, Chih-Jen Chen, Sheng-Po Wang
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Publication number: 20100073308Abstract: A touch panel and an electronic device thereof are provided. The touch panel includes a film, a substrate and a plurality of dot spacers. The dot spacers are disposed on a surface of the substrate, and the surface faces the film. In addition, the height of the dot spacers in each unit size of the substrate progressively decreases from the vertical-axis direction of the center of the substrate to the horizontal axis direction thereof.Type: ApplicationFiled: December 9, 2008Publication date: March 25, 2010Applicant: SWENC Technology Co., Ltd.Inventors: Ming-Hua Yeh, Yi-Cheng Peng, Shih-Chang Chu
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Publication number: 20100073309Abstract: A touch panel and an electronic device thereof are provided. The touch panel includes a film, a substrate and a plurality of dot spacers. The dot spacers are disposed on a surface of the substrate, and the surface faces the film. In addition, the number of/the volume of the dot spacers in each unit size of the substrate progressively decreases from the vertical-axis direction of the center of the substrate to the horizontal axis direction thereof.Type: ApplicationFiled: December 10, 2008Publication date: March 25, 2010Applicant: SWENC TECHNOLOGY CO., LTD.Inventors: Ming-Hua Yeh, Yi-Cheng Peng, Shih-Chang Chu