Abstract: A method of forming a semiconductor device is provided. Metallic interconnects are formed in a dielectric layer of the semiconductor device. A hard mask is used to avoid usual problems faced by manufacturers, such as possibility of bridging different conductive elements and via patterning problems when there are overlays between vias and trenches. The hard mask is etched multiple times to extend via landing windows, while keeping distance between the conductive elements to avoid the bridging problem.

Abstract: A method of forming a semiconductor device is provided. Metallic interconnects are formed in a dielectric layer of the semiconductor device. A hard mask is used to avoid usual problems faced by manufacturers, such as possibility of bridging different conductive elements and via patterning problems when there are overlays between vias and trenches. The hard mask is etched multiple times to extend via landing windows, while keeping distance between the conductive elements to avoid the bridging problem.

Abstract: A method of forming a semiconductor device is provided. Metallic interconnects are formed in a dielectric layer of the semiconductor device. A hard mask is used to avoid usual problems faced by manufacturers, such as possibility of bridging different conductive elements and via patterning problems when there are overlays between vias and trenches. The hard mask is etched multiple times to extend via landing windows, while keeping distance between the conductive elements to avoid the bridging problem.

Abstract: A microstructure roller formed of a cylinder and a resin pattern layer is disclosed. The microstructure roller is made by: providing a cylinder having a groove extending around the periphery, and then adhering a flexible mold plate to the periphery of the cylinder to have a cavity be defined in between the groove of the cylinder and a patterned face of microstructure patterns of the flexible mold plate, and then filling a resin in the cavity, and the curing the resin, and then removing the flexible mold plate from the cylinder.

Abstract: The present invention is related to a method for preparing polyether polyol or copolymerized polyether polyol, which uses an acid catalyst consisting of heteropoly acidic salts and oxides and/or binders. It allows tetrahydrofuran and/or cyclic ether compounds to carry out the ring-opening polymerization or ring-opening copolymerization with/without telogen, and obtains polyether polyol or copolymerized polyether polyol. An acid catalyst is used in the present invention because of its low solubility in organic solvent, so its process is simpler and the catalyst is easy to recycle for repeated use. As well, its preparation process is highly advantageous.

Abstract: This invention is directed to a process for producing cyclic ethers by liquid phase reaction, which comprises using a crystalline aluminosilicate zeolite as the catalyst, and subjecting an alkanediol to cyclodehydration at a temperature less than the boiling point of the alkanediol to obtain the corresponding cyclic ether.