Abstract: A lithium ion secondary battery is provided. The lithium ion secondary battery includes an electrolytic tank having an accommodating space, a positive electrode disposed in the accommodating space, a negative electrode disposed in the accommodating space and spaced apart from the positive electrode, and an isolation film disposed between the positive electrode and the negative electrode. In the X-ray diffraction spectrum of a first surface of the electrolytic copper foil, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. A ratio of the diffraction peak intensity I(200) of the (200) crystal face of a second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is between 0.5 and 2.0.

Abstract: A method for producing an electrolytic copper foil is provided. The method includes preparing a copper electrolytic solution including at least one addition agent and performing an electroplating step including: electrolyzing the copper electrolytic solution to form a raw foil layer. The raw foil layer has a first surface and a second surface opposite to the first surface. In the X-ray diffraction spectrum of the first surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. A ratio of the diffraction peak intensity I(200) of the (200) crystal face of the second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is between 0.5 and 2.0.

Abstract: An electrolytic copper foil includes a raw foil layer having a first surface and a second surface opposite to the first surface. In the X-ray diffraction spectrum of the first surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. In the X-ray diffraction spectrum of the second surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is also between 0.5 and 2.0. A method for producing the electrolytic copper foil, and a lithium ion secondary battery is also provided.

Abstract: An electrolytic copper foil includes a raw foil layer having a first surface and a second surface opposite to the first surface. In the X-ray diffraction spectrum of the first surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. In the X-ray diffraction spectrum of the second surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is also between 0.5 and 2.0. A method for producing the electrolytic copper foil, and a lithium ion secondary battery is also provided.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a Zn alloy thermoresistant layer.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins contribute to increase the glass transition temperature of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high glass transition temperature (TMA?200° C.) and low coefficient of thermal expansion (?1/??30/135 (?m/m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material.

Abstract: The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a Zn alloy thermoresistant layer.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C).

Abstract: The present invention provides a resin composition suitable for printed circuit boards, the composition includes one epoxy resin or the mixture thereof, curing agent, promoting agents and additives, wherein the ratio of curing agent to epoxy resin is 1.55˜2.5, in which epoxy resin consists of at least one of phenol-formaldehyde multi-functional epoxy resin; curing agent comprises at least one of styrene-maleic anhydride copolymer. After hardening, this resin composition has excellent electrical properties, high glass transition temperature and excellent heat-resistant properties, applicable to the lead-free printed circuit board manufacturing process, and in the field of the high-frequency and packaging-board containing printed circuit boards.

Abstract: A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol type novolac resins, aniline type novolac resins and phenolic type novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol type novolac resins, aniline type novolac resins and phenolic type novolac resins contribute to increase the temperature of glass transition of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high temperature of glass transition (TMA?200° C.) and low coefficient of thermal expansion (?1/??30/1350(?m/(m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material.

Abstract: The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the symmetric or saturated cyclic alphatic molecular structure with low “molecular dipole moment” characteristics; making a printed circuit board for high frequency signal transformation applications needs a proper copper clad laminate which processes the properties of a low dielectric constant and of a low dissipation factor; a copper clad laminate can meet above requirements by using the inventive resin as a laminate binder. The inventive resin is prepared by the following steps: 1. Reacting a 2,6-disubstituted mono-phenol compound (A) with an aldehyde or a cyclic diene compound (B), so as to obtain a bisphenol compound (C) having a high symmetry or saturated aliphatic heterocyclic structure; 2.