Patents by Inventor Ming Kuo

Ming Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170414
    Abstract: A semiconductor package includes an encapsulated semiconductor device, a backside redistribution structure, and a front side redistribution structure. The encapsulated semiconductor device includes an encapsulating material and a semiconductor device encapsulated by the encapsulating material. The backside redistribution structure is disposed on a backside of the encapsulated semiconductor device and includes a redistribution circuit layer and a first patterned dielectric layer. The redistribution circuit layer has a circuit pattern and a dummy pattern electrically insulated from the circuit pattern. The dummy pattern is overlapped with the semiconductor device from a top view of the semiconductor package. The first patterned dielectric layer is disposed on the redistribution circuit layer and includes a marking pattern disposed on the dummy pattern and revealing a part of the dummy pattern.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 23, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo
  • Patent number: 11988817
    Abstract: An optical imaging system includes five lens elements, the five lens elements being, in order from an object side to an image side: a first lens element having positive refractive power; a second lens element having negative refractive power; a third lens element having positive refractive power; a fourth lens element having positive refractive power; and a fifth lens element having negative refractive power.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: May 21, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chien-Hsun Wu, Tzu-Chieh Kuo, Kuan-Ming Chen
  • Patent number: 11986763
    Abstract: A remote control system for gas detection and purification is disclosed and includes a remote control device, a gas detection module and a gas purification device. The remote control device includes a gas inlet and a gas outlet. The gas detection module is disposed in the remote control device and in communication with the gas outlet to detect the gas located in an indoor space. The gas detection module provides and outputs a gas detection datum, and the remote control device transmits an operation command via wireless transmission. The gas purification device is disposed in the indoor space and receives the operating instruction transmitted from the remote control device to be operated. When the gas purification device is under the activated state, the gas in the indoor space is purified, and the purification operation mode of the gas purification device is adjusted according to the first gas detection datum.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: May 21, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chun-Yi Kuo, Yang Ku, Chang-Yen Tsai, Wei-Ming Lee
  • Publication number: 20240160828
    Abstract: A method of generating an IC layout diagram includes receiving an IC layout diagram including a gate region and a gate via, the gate via being positioned at a location within an active region and along a width of the gate region extending across the active region, receiving a first gate resistance value of the gate region, retrieving a second gate resistance value from a resistance value reference based on the location and the width, using the first and second resistance values to determine that the IC layout diagram does not comply with a design specification, and based on the non-compliance with the design specification, modifying the IC layout diagram.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Ke-Ying SU, Jon-Hsu HO, Ke-Wei SU, Liang-Yi CHEN, Wen-Hsing HSIEH, Wen-Koi LAI, Keng-Hua KUO, KuoPei LU, Lester CHANG, Ze-Ming WU
  • Publication number: 20240162109
    Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
  • Patent number: 11976018
    Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 7, 2024
    Assignee: DAXIN MATERIALS CORP.
    Inventors: Kai-Sheng Jeng, Yuan-Li Liao, You-Ming Chen, Yu-Ying Kuo, Shao-Chi Cheng
  • Patent number: 11977432
    Abstract: A data processing circuit and a fault-mitigating method are provided. In the method, multiple sub-sequences are divided from sequence data. A first sub-sequence of the sub-sequences is accessed from a memory for a multiply-accumulate (MAC) operation to obtain a first computed result. The MAC operation is performed on a second sub-sequence of the sub-sequences in the memory to obtain a second computed result. The first and the second computed results are combined, where the combined result of the first and the second computed results is related to the result of the MAC operation on the sequence data directly. Accordingly, the error rate could be reduced, so as to mitigate fault.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: May 7, 2024
    Assignee: Skymizer Taiwan Inc.
    Inventors: Shu-Ming Liu, Jen-ho Kuo, Wen Li Tang, Kai-Chiang Wu
  • Patent number: 11978390
    Abstract: A display device includes a substrate and a plurality of pixels disposed on the substrate is provided by the present disclosure. The substrate has an edge, wherein the edge extends along a first direction. The plurality of pixels include a first pixel closest to the edge and a second pixel adjacent to the first pixel, wherein the first pixel and the second pixel are arranged along a second direction perpendicular to the first direction, and any one of the first pixel and the second pixel includes a plurality of sub-pixels arranged along the first direction. A width of the first pixel is less than a width of the second pixel in the second direction.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: May 7, 2024
    Assignee: InnoLux Corporation
    Inventor: Shu-Ming Kuo
  • Publication number: 20240141922
    Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20240130614
    Abstract: An intraocular pressure inspection device includes an intraocular pressure detection unit, a high-precision positioning system and a wide-area positioning system, wherein according to the position of the intraocular pressure detection unit, a set of high-precision coordinates output by the high-precision positioning system and a set of wide-area coordinates output by the wide-area positioning system are integrated in appropriate weights to obtain a set of more precise integrated coordinate. The above-mentioned intraocular pressure inspection device can prevent the intraocular pressure detection unit from failing to operate once it is not in the working area of the high-precision positioning system.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 25, 2024
    Inventors: Shao Hung HUANG, Chao-Ting CHEN, Fong Hao KUO, Yu-Chung TUNG, Chu-Ming CHENG, Chi-Yuan KANG
  • Patent number: 11968556
    Abstract: A network quality measurement method and system are provided. In the method, a movement path and a movement speed of a vehicle device are determined according to a size of a space and an endurance time of the vehicle device, and the vehicle device is controlled to move on the movement path at the movement speed. During a movement of the vehicle device, a network quality in the space is measured according to a measurement frequency to generate network quality data. Whether the network quality in the space is changed is determined according to the network quality data. Whether there is an obstacle around the vehicle device is detected. When it is determined that the network quality in the space is changed or the obstacle is detected around the vehicle device, at least one of the movement path, the movement speed, and the measurement frequency is adjusted.
    Type: Grant
    Filed: December 26, 2021
    Date of Patent: April 23, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Hui-Ping Kuo, Sheng-Chieh Huang, Hsin-Hui Hwang, Yi-Ming Wu, Man Ju Chien
  • Publication number: 20240120376
    Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first active region extending lengthwise along a first direction and having a first width along a second direction perpendicular to the first direction, a second active region extending lengthwise along the first direction and having a second width along the second direction, and an epitaxial feature sandwiched between the first active region and the second active region along the first direction. The first width is greater than the second width.
    Type: Application
    Filed: January 26, 2023
    Publication date: April 11, 2024
    Inventors: Po Shao Lin, Jiun-Ming Kuo, Yuan-Ching Peng, You-Ting Lin, Yu Mei Jian
  • Publication number: 20240121523
    Abstract: A light-adjusting device having first regions and second regions is provided. The light-adjusting device includes pillars that form several groups of meta structures. The groups of meta structures correspond to the first regions, and from a top view, the first regions and the second regions are arranged in a checkerboard pattern.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Kai-Hao CHANG, Chun-Yuan WANG, Shin-Hong KUO, Zong-Ru TU, Po-Hsiang WANG, Chih-Ming WANG
  • Patent number: 11953740
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Publication number: 20240112358
    Abstract: Systems and techniques are provided for deep learning model optimizations. An example process can include generating, based on processing data using a neural network model, a plurality of prediction outputs associated with a plurality of output channels corresponding to a multi-channel prediction target; determining that a prediction output from the plurality of prediction outputs has a value that is outside of a quantization range and one or more remaining prediction outputs from the plurality of prediction outputs have a respective value that is within the quantization range; clamping the prediction output based on the quantization range; and generating a single channel output based on the clamped prediction output and the one or more remaining prediction outputs.
    Type: Application
    Filed: September 22, 2022
    Publication date: April 4, 2024
    Inventors: Chieh-Ming KUO, Michel Adib SARKIS
  • Patent number: 11947173
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11944412
    Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
  • Publication number: 20240107702
    Abstract: An information handling system having a reconfigurable cooling fan holder including a plurality of cooling fans of a cooling system operatively coupled to the reconfigurable cooling fan holder, a reconfigurable frame having a plurality of slidingly adjustable walls including a pair of lengthwise slidingly adjustable walls and a widthwise slidingly adjustable wall where the pair of lengthwise slidingly adjustable walls may be expanded or reduced in length by sliding the at least two slide bars nested adjacent to one another forming each lengthwise slidingly adjustable wall to extend or contract each lengthwise slidingly adjustable wall, and the widthwise slidingly adjustable wall may be expanded or reduced in width by sliding the at least two slide bars nested adjacent to one another forming the widthwise slidingly adjustable wall to extend or contract the widthwise slidingly adjustable wall for adjusting the width and length of the reconfigurable cooling fan holder.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Applicant: Dell Products, LP
    Inventors: Chung-An Lin, Yu-Ming Kuo, Chih-Yung Yang
  • Publication number: 20240105814
    Abstract: A first layer is formed over a substrate; a second layer is formed over the first layer; and a third layer is formed over the second layer. The first and third layers each have a first semiconductor element; the second layer has a second semiconductor element different from the first semiconductor element. The second layer has the second semiconductor element at a first concentration in a first region and at a second concentration in a second region of the second layer. A source/drain trench is formed in a region of the stack to expose side surfaces of the layers. A first portion of the second layer is removed from the exposed side surface to form a gap between the first and the third layers. A spacer is formed in the gap. A source/drain feature is formed in the source/drain trench and on a sidewall of the spacer.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Che-Lun Chang, Jiun-Ming Kuo, Ji-Yin Tsai, Yuan-Ching Peng
  • Patent number: 11943584
    Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: March 26, 2024
    Assignee: FORTEMEDIA, INC.
    Inventors: Chih-Yuan Chen, Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Nai-Hao Kuo