Patents by Inventor Ming Kwan Tse

Ming Kwan Tse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8740152
    Abstract: Methods for attaching a window to an airframe, methods of maintaining structural integrity of an airframe while attaching a window to the airframe, and portions of an aircraft are set forth herein. One method for attaching a window to an airframe comprises the steps of: applying to a bonding surface of a nutplate an adhesive; inserting through an airframe hole a fixture attached to a nut of the nutplate, and applying tension to the fixture to hold the adhesive-coated bonding surface of the nutplate adjacent an interior surface of the airframe; allowing the adhesive to cure; removing the fixture from the nut of the nutplate; and installing a bolt through a hole of a retainer, through the hole in the airframe, and into the nutplate; the retainer being in contact with and securing the window to the airframe. The adhesive is selected such that very specific conditions are met.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: June 3, 2014
    Assignee: Textron Innovations, Inc.
    Inventors: Daniel J. Lyon, Ming Kwan Tse
  • Publication number: 20130087269
    Abstract: In one aspect, the present disclosure relates to a method to bond fiber reinforced polymer composite tape layers to make reinforcement stacks. The method includes collecting a plurality of composite tape layers to form a reinforcement stack, helically winding the reinforcement stack; and curing an adhesive on one or more surfaces of the plurality of composite tape layers by exposing the reinforcement stack to radiation. In another aspect, the present disclosure relates to a method to bond fiber reinforced polymer composite reinforcement stacks. The method includes collecting a plurality of composite tape layers each comprising at least one resin-rich surface to form a reinforcement stack, helically winding the reinforcement stack, and bonding the reinforcement stack by exposing the reinforcement stack to radiation. In another aspect, the present disclosure relates to an apparatus to bond polymer composite reinforcement stacks.
    Type: Application
    Filed: March 3, 2011
    Publication date: April 11, 2013
    Inventor: Ming Kwan Tse