Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to a pad at the second side of the semiconductor die; and a molding compound encapsulating the die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

Abstract: Described are multi-resonance-thermally-activated delay-fluorescence compounds containing (i) a polycyclic aromatic/heteroaromatic ligand in which a plurality aromatic/heteroaromatic rings are linked by boron and nitrogen atoms and (ii) an N-heterocyclic carbene ligand, with both ligands coordinated to a metal atom/ion that has a high spin-orbit coupling. The use of the high spin-orbit coupling of metals and/or metal ions facilitates the intersystem crossing and/or reversed intersystem crossing processes of MR-TADF emitters, thereby largely accelerating the rate of TADF and substantially shortening the lifetime of deleterious triplet excitons. The MR-TADF emitters can be used to fabricate blue to green emitting OLEDs.

Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.

Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

Abstract: During operation, a computer system may provide instructions to access points in an indoor environment to measure relative distances between the access points. Then, the computer system may receive the measured relative distances. Moreover, the computer system may calculate geographic locations of the access points based at least in part on the measured relative distances. Next, the computer system may select potential anchor access points in the access points, and may provide, to an electronic device, information specifying the potential anchor access points. Furthermore, the computer system may receive, from the electronic device, second information specifying anchor access points in the potential access points and defined locations of the anchor access points. Additionally, the computer system may update the geographic locations based at least in part on the defined of the anchor access points, and may provide, to the access points, the updated geographic locations.

Abstract: Provided are systems and methods for producing seamless woven materials that are variable in each of their 3 dimensions. The systems and methods generally operate by altering heddle positions independently to impart three dimensional structure to a woven fabric. Weft yarn is woven into a set of warp yarns that have been individually raised or lowered along a particular cross section, essentially locking the weave into an intended 3 dimensional form.

Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a pad at a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to the pad; and a molding compound encapsulating the semiconductor die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

Abstract: Apparatus and method for determining the validity of an infrared signal of a remote-control device. An infrared signal comprising pulses representing data corresponding to a function of a controllable target device is received from a remote-control device. The received infrared signal is passed through a capacitor of the apparatus such that, for each pulse of the infrared signal, the capacitor is charged and subsequently discharged. The capacitor discharge time associated with each pulse of the infrared signal is measured by a processor of the apparatus to establish a discharge sequence. The processor of the apparatus compares the established discharge sequence with a plurality of pre-determined valid discharge patterns and determine the validity of the received infrared signal based on the outcome of the comparison of the established discharge sequence with the plurality of pre-determined discharge patterns.

Abstract: A farming method includes: loading a broad spectrum of plant nutrients into a zeolite substrate; using the loaded zeolite substrate to grow crops for a plurality of cycles; and recycling the used zeolite substrate.

Abstract: An anti-vibration device for sound equipment having a stress frame with an adjustable shape to form a complimentary shape to the sound equipment so that vibration is optimized by setting the adjustable shape. The anti-vibration device can be used in a rack with other anti-vibration devices or between sound equipment and a support platform. The anti-vibration device may also be used on top of the sound equipment while supporting a variable weight.

Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a pad at a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to the pad; and a molding compound encapsulating the semiconductor die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

Abstract: A battery charging curve learning device comprises: a loading module connected to a target charger, a first sampling module connected to the loading module, a boosting module connected to the target charger, and a controller connected to the loading module, the first sampling module, and the boosting module; the loading module is configured to simulate a load to make the target charger output the maximum power within the current time; the first sampling module is configured to collect the current output current and the current output voltage of the target charger, and send the collected parameters to the controller; the boosting module is configured to provide a starting voltage for the target charger; the controller is configured to control the operation of the loading module, the first sampling module, and the boosting module, and perform charging timer to obtain the charging time, and then obtain the charging curve of the battery applicable to the target charger according to the collection parameters of th

Abstract: An optical subassembly structure for mode conversion by an active alignment of an optical fiber with a semiconductor optical waveguide includes a sub-mount for holding the optical subassembly structure, a semiconductor die mounting on the sub-mount, the semiconductor optical waveguide growing on the semiconductor die and a glass capillary subassembly actively aligned to the semiconductor optical waveguide.

Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

Abstract: A method for fabricating a power semiconductor package includes: providing a leadframe having a die pad and a frame, wherein the die pad is connected to the frame by at least one tie bar; attaching a semiconductor die to the die pad; laser cutting through the at least one tie bar, thereby forming a cut surface; and after the laser cutting, molding over the die pad and the semiconductor die, wherein the cut surface is completely covered by molding compound.

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

Abstract: Disclosed are nitrile-vinylidene substituted aromatic polymers which include less than about 250 ppm of vinylidene substituted aromatic monomer. Also disclosed is a method of minimizing nitrile migration in nitrile-vinylidene substituted aromatic polymers where the amount of residual vinylidene substituted aromatic monomer in the nitrile-vinylidene substituted aromatic polymer is reduced. Also disclosed is a method of making nitrile-vinylidene substituted aromatic polymers which includes less than about 250 ppm of styrene monomer.