Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

Abstract: A chip with a bump structure comprises a chip, a plurality of pads and a plurality of bumps. The chip includes a microcircuit fabricated by integrated circuit technique. The pads are metallized portions of the chip for electrical connection. The bumps are metal bulges on the pads of the chip for electrically connecting the pads with the terminals of other components. The bumps are arranged in a horizontal direction, and each of the bumps include a first section and a second section. wherein the first section and the second section are electrically connected to each other along a vertical direction. The first section electrically contacts the corresponding pad. The size of the second section in the horizontal direction is larger than that of the first section. The second section is used for electrically connecting the chip to other components. The first section and the second section of adjacent bumps are interlaced.

Abstract: A chip with a bump structure comprises a chip, a plurality of pads and a plurality of bumps. The chip includes a microcircuit fabricated by integrated circuit technique. The pads are metallized portions of the chip for electrical connection. The bumps are metal bulges on the pads of the chip for electrically connecting the pads with the terminals of other components. The bumps are arranged in a horizontal direction, and each of the bumps include a first section and a second section, wherein the first section and the second section are electrically connected to each other along a vertical direction. The first section electrically contacts the corresponding pad. The size of the second section in the horizontal direction is larger than that of the first section. The second section is used for electrically connecting the chip to other components. The first section and the second section of adjacent bumps are interlaced.